NOVEL POLYIMIDE PRECURSOR COMPOSITION, USE OF THE SAME, AND PRODUCTION METHOD OF THE SAME

• US 20110061914A1
• Filed: 05/14/2009
• Published: 03/17/2011
• Est. Priority Date: 05/20/2008
• Status: Active Grant

• Current Assignee: Kaneka Corporation
• Original Assignee: Kaneka Corporation
• Inventors: Sekito, Yoshihide
• Granted Patent: US 8,729,402 B2
• Time in Patent Office: Days
• US Class Current: 174/258
• CPC Class Codes: C08G 18/341 Dicarboxylic acids, esters of polycarboxylic acids containing two carboxylic acid groups
• CPC Class Codes: C08G 18/346 having four carboxylic acid groups
• CPC Class Codes: C08G 18/758 containing two or more cycloaliphatic rings
• CPC Class Codes: C08G 18/7621 being toluene diisocyanate including isomer mixtures
• CPC Class Codes: C08G 73/10 Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
• CPC Class Codes: C08G 73/1046 Polyimides containing oxygen in the form of ether bonds in the main chain
• CPC Class Codes: C08G 73/106 containing silicon
• CPC Class Codes: C09D 179/08 Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
• CPC Class Codes: G03F 7/037 the binders being polyamides or polyimides
• CPC Class Codes: H05K 1/0346 containing N
• CPC Class Codes: H05K 3/287 Photosensitive compositions

Abstract

An object of the present invention is to provide (i) a polyimide precursor composition which is curable at a low temperature (not more than 250° C.) and which has a low viscosity despite having a high concentration, and a production method thereof, (ii) a polyimide coating film obtained from the polyimide precursor composition and having good properties, and a production method thereof, (iii) a photosensitive resin composition prepared by use of the polyimide precursor composition, and a production method thereof. The object of the present invention can be attained by a polyimide precursor composition containing an imidized tetracarboxylic acid having a specific structure and an isocyanate compound having a specific structure, or optionally a diamine.

Claims

1. A polyimide precursor composition containing at least an isocyanate compound and an imidized tetracarboxylic acid represented by General Formula (1):

2. The polyimide precursor composition as set forth in claim 1, further containing a diamine represented by General Formula (2):

[Chem. 2]

H₂N—

R″

—

NH₂ 

 

(2)

wherein R″

represents a divalent organic group.

3. The polyimide precursor composition as set forth in claim 1, wherein R in General Formula (1) is a tetravalent organic group selected from General Formula Group (1):

4. The polyimide precursor composition as set forth in claim 1, wherein R′

in General Formula (1) has at least a divalent organic group selected from General Formula Group (2);

5. The polyimide precursor composition as set forth in claim 1, wherein R″

in General Formula (2) is a divalent organic group selected from General Formula Group (3);

6. A polyimide precursor composition solution obtained by dissolving a polyimide precursor composition as set forth in claim 1 so that the polyimide precursor composition solution has a solute concentration of 40 to 90% by weight.

7. A polyimide coating film obtained from either a polyimide precursor composition as set forth in claim 1.

8. A printed wiring board comprising a polyimide coating film obtained by (i) applying, to the printed wiring board, either a polyimide precursor composition as set forth in claim 1, and (ii) heating and imidizing the polyimide precursor composition thus applied.

9. A photosensitive resin composition containing:

a polyimide precursor composition as set forth in claim 1; and

at least a photosensitive resin and a photopolymerization initiator.

16. A polyimide coating film obtained from a polyimide precursor composition solution as set forth in claim 6.

17. A printed wiring board comprising a polyimide coating film obtained by (i) applying, to the printed wiring board, a polyimide precursor composition solution as set forth in claim 6, and (ii) heating and imidizing the polyimide precursor composition solution thus applied.

10. A method for producing a polyimide precursor composition comprising the steps of:

(a) carrying out a reaction between a tetracarboxylic acid dianhydride represented by General Formula (3);

11. The method as set forth in claim 10, wherein:

the diamine represented by General Formula (4) includes at least a diamine selected from General Formula Group (4);

12. A method for producing a polyimide precursor composition solution, comprising the step of:

dissolving into an organic solvent a polyimide precursor composition produced by a method as set forth in claim 10 so that the polyimide precursor composition solution has a solute concentration of 40 to 90% by weight.

13. A method for producing a polyimide coating film, comprising the step of:

forming the polyimide coating film from either a polyimide precursor composition produced by a method as set forth in claim 10.

14. A method for producing a printed wiring board including a polyimide coating film, comprising the steps of:

applying to a printed wiring board a polyimide precursor composition produced by a method as set forth in claim 10; and

heating and imidizing the polyimide precursor composition thus applied.

15. A method for producing a photosensitive resin composition, comprising the step of:

mixing a polyimide precursor composition produced by a method as set forth in claim 10, at least a photosensitive resin, and a photopolymerization initiator.

18. A method for producing a polyimide coating film, comprising the step of:

forming the polyimide coating film from a polyimide precursor composition solution produced by a method as set forth in claim 12.

19. A method for producing a printed wiring board including a polyimide coating film, comprising the steps of:

applying to a printed wiring board a polyimide precursor composition solution produced by a method as set forth in claim 12; and

heating and imidizing the polyimide precursor composition solution thus applied.