FLEXIBLE WIRELESS PATCH FOR PHYSIOLOGICAL MONITORING AND METHODS OF MANUFACTURING THE SAME

• US 20110062241A1
• Filed: 10/22/2008
• Published: 03/17/2011
• Est. Priority Date: 10/24/2007
• Status: Active Grant

• Current Assignee: HMicro Inc.
• Original Assignee: HMicro Inc.
• Inventors: Beck, James C.
• Granted Patent: US 8,628,020 B2
• Time in Patent Office: Days
• US Class Current: 235/492
• CPC Class Codes: A61B 2560/0214 of power generation or supply
• CPC Class Codes: A61B 2560/0412 Low-profile patch shaped housings
• CPC Class Codes: A61B 2562/125 characterised by the manufacture of electrodes
• CPC Class Codes: A61B 5/0002 Remote monitoring of patients using telemetry, e.g. transmission of vital signals via a communication network A61B5/07 takes precedence; transmission systems for measured values G08C; transmission H04B; transmission of digital information H04L; wireless communication networks H04W
• CPC Class Codes: A61B 5/0015 characterised by features of the telemetry system
• CPC Class Codes: A61B 5/24 Detecting, measuring or recording bioelectric or biomagnetic signals of the body or parts thereof
• CPC Class Codes: A61B 5/282 Holders for multiple electrodes for introduction into the body A61B5/287
• CPC Class Codes: A61B 5/6801 specially adapted to be attached to or worn on the body surface
• CPC Class Codes: A61B 5/6833 Adhesive patches
• CPC Class Codes: A61B 5/6841 by using templates
• CPC Class Codes: A61B 5/7203 for noise prevention, reduction or removal
• CPC Class Codes: H01P 11/00 Apparatus or processes specially adapted for manufacturing waveguides or resonators, lines, or other devices of the waveguide type
• CPC Class Codes: Y10T 29/49016 Antenna or wave energy "plumbing" making
• CPC Class Codes: Y10T 29/49117 Conductor or circuit manufacturing

Abstract

Provided herein is an integrated wireless patch comprising a contact layer, an electronics layer, and a battery layer. The contact layer is a substrate having gel cutouts. The electronics layer can be folded into contact with the contact layer. The battery layer can be folded into contact with the electronic layer. Further provided herein is a method of manufacturing a wireless integrated patch comprising folding a substrate comprising at least one cutout, at least one contact disk in communication with a surface of a patient through the cutout, and battery terminals, wherein the at least one cutout, the at least on contact, and the battery terminals are adaptable to be located in different layers after the substrate is folded.

Claims

1. An integrated wireless patch which comprises:

a contact layer comprising a substrate;

an electronic layer folded into contact with the contact layer; and

a battery layer folded into contact with the electronic layer.

2. The patch of claim 1 wherein the battery layer comprises battery terminal tabs.

3. The patch of claim 1 wherein the battery layer further comprises at least one antenna.

4. The patch of claim 1 wherein the patch is adaptable to be assembled by positioning the electronic layer between the contact layer and the battery layer.

5. The patch of claim 1 further comprising an adhesive layer adaptable to be located between the contact layer and the electronic layer.

6. The patch of claim 1 further comprising a battery.

7. The patch of claim 1 wherein the contact layer comprises at least one contact adaptable to be in communication with a surface of a patient.

8. The patch of claim 7 wherein the contact layer further comprises an adhesive surround positioned around the contact.

9. The patch of claim 1 further comprising at least one antenna.

10. The patch of claim 1 further comprising at least one application-specific integrated circuit on the electronic layer.

11. A method of manufacturing a wireless integrated patch comprising:

folding a substrate comprising at least one cutout, at least one contact disk in communication with a surface of a patient through the cutout, and battery terminals, wherein the at least one cutout, the at least on contact, and the battery terminals are adaptable to be located in different layers after the substrate is folded.

12. The method of claim 11 further comprising the step of attaching a battery to the battery terminals.

13. The method of claim 11 further comprising the step of creating a cutout in the substrate prior to the folding step.

14. The method of claim 11 further comprising the step fabricating at least one contact on the substrate prior to the folding step.

15. The method of claim 14 further comprising the step of attaching an ASIC to the substrate and further comprising the step of connecting the at least one contact to the ASIC with a trace.

16. The method of claim 15 further comprising the step of connecting an antenna to the ASIC.

17. The method of claim 11 further comprising the step of inserting an adhesive spacer between two layers of the folded substrate.

18. The method of claim 17 wherein the adhesive spacer is inserted in between the cutout layer and the contact layer.

19. The method of claim 11 further comprising the step of applying gel to the cutout area.

20. The method of claim 11 further comprising the step of attaching an adhesive washer around the cutout.

21. The method of claim 11 further comprising the step of cutting spiral cuts, the spiral cuts adaptable to surround the cutout.

22. A wireless integrated patch produced according to the method of claim 11.

23. The method of claim 11 further comprising more than one cutout and more than one contact.