COMPONENT OF WIRELESS IC DEVICE AND WIRELESS IC DEVICE

• US 20110062244A1
• Filed: 11/11/2010
• Published: 03/17/2011
• Est. Priority Date: 05/28/2008
• Status: Active Grant

• Current Assignee: Murata Manufacturing Co Limited
• Original Assignee: Murata Manufacturing Co Limited
• Inventors: KATO, Noboru, SASAKI, Jun
• Granted Patent: US 8,596,545 B2
• Time in Patent Office: Days
• US Class Current: 235/492
• CPC Class Codes: G06K 19/07749 the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
• CPC Class Codes: H01Q 1/2225 used in active tags, i.e. provided with its own power source or in passive tags, i.e. deriving power from RF signal
• CPC Class Codes: H01Q 7/00 Loop antennas with a substantially uniform current distribution around the loop and having a directional radiation pattern in a plane perpendicular to the plane of the loop

Abstract

A component of a wireless IC device includes a wireless IC chip and a feeding circuit substrate including a plurality of laminated resin layers. The wireless IC chip is included inside the feeding circuit substrate, and an annular electrode is arranged inside the feeding circuit substrate. The component of a wireless IC device and the radiation plate define the wireless IC device.

Claims

1. A component of a wireless IC device, comprising:

a wireless IC; and

a feeding circuit substrate including a feeding circuit including a resonance circuit including at least one of an inductance element coupled to the wireless IC, and a matching circuit, the wireless IC being included in the feeding circuit substrate;

wherein

the feeding circuit substrate is a multilayered substrate including a plurality of resin layers and a plurality of electrodes laminated in a lamination direction.

2. The component of a wireless IC device according to claim 1, wherein the feeding circuit substrate includes a first main surface and a second main surface, and the feeding circuit is arranged between the wireless IC and the first main surface in the lamination direction and between the wireless IC and the second main surface.

3. The component of a wireless IC device according to claim 1, wherein at least one stress alleviating electrode arranged to alleviate a stress on the wireless IC is arranged directly above and/or directly below the wireless IC.

4. The component of a wireless IC device according to claim 1, wherein the inductance element is defined by at least one annular electrode having an annular shape and including a via hole conductor provided in the feeding circuit substrate and the plurality of electrodes, and a winding axis of the annular electrode is perpendicular or substantially perpendicular to the lamination direction.

5. The component of a wireless IC device according to claim 4, wherein when the annular electrode is viewed from a direction perpendicular or substantially perpendicular to the lamination direction, the wireless IC is arranged inside of the annular electrode.

6. The component of a wireless IC device according to claim 1, wherein the feeding circuit includes capacitance elements arranged such that the plurality of electrodes oppose one another.

7. The component of a wireless IC device according to claim 6, wherein the plurality of electrodes of the capacitance elements also define stress alleviating electrodes arranged to alleviate a stress on the wireless IC.

8. The component of a wireless IC device according to claim 1, wherein

the feeding circuit substrate includes a flexible portion and a rigid portion;

and

the wireless IC is arranged in the rigid portion.

9. The component of a wireless IC device according to claim 8, wherein the rigid portion is defined by the annular electrode.

10. The component of a wireless IC device according to claim 3, wherein

the feeding circuit substrate includes a flexible portion and a rigid portion;

the wireless IC is arranged in the rigid portion; and

the rigid portion is defined by the at least one stress alleviating electrode.

11. A wireless IC device comprising:

the component of a wireless IC device according to claim 1; and

a radiation plate arranged to be electromagnetically coupled to the feeding circuit.

12. The wireless IC device according to claim 11, wherein a portion of the annular electrode is arranged in proximity to the radiation plate.

13. The wireless IC device according to claim 11, wherein a frequency of a signal that is transmitted and received in the radiation plate is substantially determined by a resonance frequency of the feeding circuit.