LED ARRANGEMENT

• US 20110062464A1
• Filed: 05/11/2009
• Published: 03/17/2011
• Est. Priority Date: 05/13/2008
• Status: Active Grant

• Current Assignee: Siemens AG
• Original Assignee: Siemens AG
• Inventors: Gerhard, Detlef
• Granted Patent: US 8,183,581 B2
• Time in Patent Office: Days
• US Class Current: 257/93
• CPC Class Codes: F21Y 2107/50 on planar substrates or supports, but arranged in different planes or with differing orientation, e.g. on plate-shaped supports with steps on which light-generating elements are mounted
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 25/0753 the devices being arranged next to each other
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 33/483 Containers
• CPC Class Codes: H01L 33/486 adapted for surface mounting
• CPC Class Codes: H01L 33/62 Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
• CPC Class Codes: H01L 33/647 the elements conducting electric current to or from the semiconductor body

Abstract

An LED arrangement (light emitting diode) has a plurality of adjacent radiating LEDs that are nearly identically aligned for forming an extended area light source. The LEDs are attached to a metallic multi-film support having sandwich-like insulating intermediate layers and having at least a step-like structure with at least one step. At least one LED chip is placed on each step on a metal film and the metal layer directly above is formed of a corresponding shortening or recess for mounting an LED.

Claims

1-6. -6. (canceled)

7. An light emitting diode (LED) arrangement, comprising:

a plurality of LED chips which are arranged in an adjacent fashion, which emit in an approximately identical direction and which together form an areally extended light source; and

a metallic multi-film carrier, which has insulating intermediate layers sandwiched between metal films, the metallic multi-film carrier having a stepped structure with a plurality of steps, wherein

each step is formed by a corresponding shortening or cutout of a respective overlying metal film, such that each step includes at least one insulating intermediate layer and at least one metal film,

each LED chip is positioned on a step and electrically contact-connected to the metal film of the step, and

each LED chip is also electrically contact-connected to the metal film of an adjacent step.

8. The LED arrangement as claimed in claim 7, wherein at some of the LED chips are connected in series.

9. The LED arrangement as claimed in claim 7, wherein

the LED chips are divided into groups, and

the LED chips of each group are connected in series.

10. The LED arrangement as claimed in claim 7, wherein

at least some of the LED chips are connected in parallel.

11. The LED arrangement as claimed in claim 7, wherein

the LED chips are divided into groups, and

the LED chips of each group are connected in parallel.

12. The LED arrangement as claimed in claim 7, wherein

an electrical circuit connects the LED chips,

the electrical circuit includes a plurality of series LED connections and a plurality of parallel LED connections.

13. The LED arrangement as claimed in claim 12, wherein

each LED is connected to at least one series connection and at least one parallel connection.

14. The LED arrangement as claimed in claim 9,

metal films of adjacent steps have opposite polarity, and

each LED chip has an electrical connection pad coupled via a contact wire to the metal film of the adjacent step, which metal film has opposite polarity.

15. The LED arrangement as claimed in claim 14, wherein the metal films, at regions remote from the LED chips, are contact-connected to a control source via respective electrical connections.

16. The LED arrangement as claimed in claim 15, wherein the metal films are thermally connected to the LED chips to dissipate heat from the LED chips.

17. The LED arrangement as claimed in claim 16, wherein

the LED chips are divided into groups, and

the LED chips of each group are connected in parallel.

18. The LED arrangement as claimed in claim 17, wherein

an electrical circuit connects the LED chips,

the electrical circuit includes a plurality of series LED connections and a plurality of parallel LED connections.

19. The LED arrangement as claimed in claim 18, wherein

each LED is connected to at least one series connection and at least one parallel connection.

20. The LED arrangement as claimed in claim 19,

metal films of adjacent steps have opposite polarity, and

each LED chip has an electrical connection pad coupled via a contact wire to the metal film of the adjacent step, which metal film has opposite polarity.

21. The LED arrangement as claimed in claim 20, wherein the metal films, at regions remote from the LED chips, are contact-connected to a control source via respective electrical connections.

22. The LED arrangement as claimed in claim 21, wherein the metal films are thermally connected to the LED chips to dissipate heat from the LED chips.