ELECTRONIC COMPONENT

• US 20110062534A1
• Filed: 11/22/2010
• Published: 03/17/2011
• Est. Priority Date: 11/05/2007
• Status: Active Grant

• Current Assignee: Seiko Epson Corporation (Seiko Group)
• Original Assignee: Seiko Epson Corporation (Seiko Group)
• Inventors: HASHIMOTO, Nobuaki
• Granted Patent: US 8,097,817 B2
• Time in Patent Office: Days
• US Class Current: 257/416
• CPC Class Codes: H01L 2224/02377 Fan-in arrangement
• CPC Class Codes: H01L 2224/05001 Internal layers
• CPC Class Codes: H01L 2224/05008 Bonding area integrally formed with a redistribution layer on the semiconductor or solid-state body, e.g.
• CPC Class Codes: H01L 2224/05022 the internal layer being at least partially embedded in the surface
• CPC Class Codes: H01L 2224/05124 Aluminium [Al] as principal constituent
• CPC Class Codes: H01L 2224/05139 Silver [Ag] as principal constituent
• CPC Class Codes: H01L 2224/05144 Gold [Au] as principal constituent
• CPC Class Codes: H01L 2224/05147 Copper [Cu] as principal constituent
• CPC Class Codes: H01L 2224/05155 Nickel [Ni] as principal constituent
• CPC Class Codes: H01L 2224/05166 Titanium [Ti] as principal constituent
• CPC Class Codes: H01L 2224/05171 Chromium [Cr] as principal constituent
• CPC Class Codes: H01L 2224/05184 Tungsten [W] as principal constituent
• CPC Class Codes: H01L 2224/05572 the external layer extending out of an opening
• CPC Class Codes: H01L 2224/05644 Gold [Au] as principal constituent
• CPC Class Codes: H01L 2224/16225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 24/05 of an individual bonding area
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/15311 being a ball array, e.g. BGA
• CPC Class Codes: H03H 9/1021 the BAW device being of the cantilever type
• CPC Class Codes: H03H 9/1092 the enclosure being defined by a cover cap mounted on an element forming part of the surface acoustic wave [SAW] device on the side of the IDT's

Abstract

An electronic component includes: a first substrate having a through-hole; a second substrate opposite the first substrate; a sealing member surrounding a sealing space formed between the first substrate and the second substrate; a functional element having at least a part thereof disposed in the sealing space, and a through-electrode filling the through-hole, the through-hole penetrating the first substrate. The sealing member includes an elastic core part on the first substrate. A metal film is on a surface of the core part and is bonded to the second substrate.

Claims

1. An electronic component, comprising:

a first substrate having a through-hole;

a second substrate opposite the first substrate;

a sealing member surrounding a sealing space formed between the first substrate and the second substrate;

a functional element having at least a part thereof disposed in the sealing space, and

a through-electrode filling the through-hole, the through-hole penetrating the first substrate,

wherein the sealing member includes a core part on the first substrate, the core part having elasticity; and

a metal film on a surface of the core part, the metal film being bonded to the second substrate.

2. The electronic component according to claim 1, wherein an insulating film is provided along a circumferential face of the through-hole.

3. The electronic component according to claim 1, wherein a bonding film metal-bonded with the metal film is in a region of the second substrate contacting the sealing member.

4. The electronic component according to claim 1, wherein an integrated circuit is on an outer face of the first substrate.

5. The electronic component according to claim 4, wherein an insulating film is on outer surface of the first substrate and on the integrated circuit.

6. The electronic component according to claim 1, wherein the functional element further comprises a surface acoustic wave device.