Electromagnetic interference noise reduction board using electromagnetic bandgap structure

• US 20110067915A1
• Filed: 12/17/2009
• Published: 03/24/2011
• Est. Priority Date: 09/22/2009
• Status: Active Grant

• Current Assignee: Samsung Electro-Mechanics Co., Ltd. (Samsung Group)
• Original Assignee: Samsung Electro-Mechanics Co., Ltd. (Samsung Group)
• Inventors: Park, Dae-Hyun, Han, Mi-Ja, Jung, Hyo-Jic, Bong, Kang-Wook, Kim, Han
• Granted Patent: US 8,212,150 B2
• Time in Patent Office: Days
• US Class Current: 174/350
• CPC Class Codes: H01L 2224/16225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H05K 1/0236 Electromagnetic band-gap structures
• CPC Class Codes: H05K 2201/09309 Core having two or more power planes; Capacitive laminate of two power planes
• CPC Class Codes: H05K 2201/09627 Special connections between adjacent vias, not for grounding vias

Abstract

An EMI noise reduction board is disclosed. The electromagnetic interference (EMI) noise reduction board having an electromagnetic bandgap structure for shielding a noise includes: a first area having a ground layer and a power layer; a second area placed in a side portion of the first area having an electromagnetic bandgap structure therein. The electromagnetic bandgap structure includes: a plurality of first conductive plates and a plurality of second conductive plates placed on a same planar surface along the side portion of the first area; and a stitching via configured to electrically connect the first conductive plate to the second conductive plate through a planar surface that is different from the first conductive plate and the second conductive plate.

Claims

1. An electromagnetic interference (EMI) noise reduction board having an electromagnetic bandgap structure for shielding a noise, comprising:

a first area having a ground layer and a power layer; and

a second area placed in a side portion of the first area and having an electromagnetic bandgap structure therein so as to shield an EMI noise radiated to the outside through the side portion of the first area,

wherein the electromagnetic bandgap structure comprises;

a plurality of first conductive plates and a plurality of second conductive plates placed on a same planar surface along the side portion of the first area; and

a stitching via configured to electrically connect the first conductive plates and the second conductive plates through a planar surface that is different from the first conductive plates and the second conductive plates.

2. The EMI noise reduction board of claim 1, wherein the stitching via comprises:

a connection pattern, placed on a planar surface that is different form the first conductive plate and the second conductive plate;

a first via, configured to electrically connect one side of the connection pattern to the first conductive plates; and

a second via, configured to electrically connect the other side of the connection pattern to the second conductive plate.

3. The EMI noise reduction board of claim 2, wherein the first area comprises:

a first metal layer arranged on a same planar surface as that of the connection pattern; and

a second metal layer arranged on a same planar surface as that of the first conductive plate and the second conductive plates,

wherein the first metal layer is expanded to the second area to surround the connection pattern.

4. The EMI noise reduction board of claim 2, wherein the first area and the second area are a multi-layer having 4 or more layers, and at least one of the first via and the second via is a penetration via that penetrates the second area vertically.

5. The EMI noise reduction board of claim 2, wherein at least one of the first via and the second via is a blind via.

6. The EMI noise reduction board of claim 1, wherein at least one of the first conductive plate and the second conductive plate has a bump or an indentation shape corresponding to an outline shape of the first area.

7. The EMI noise reduction board of claim 1, wherein the second area is selectively arranged in a certain portion of the side portion of the first area.

8. The EMI noise reduction board of claim 1, wherein the first conductive plate and the second conductive plate are arranged on a same planar surface as that of the power layer.