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Wafer Backside Interconnect Structure Connected to TSVs

  • US 20110068466A1
  • Filed: 07/07/2010
  • Published: 03/24/2011
  • Est. Priority Date: 09/22/2009
  • Status: Active Grant
First Claim
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1. An integrated circuit structure comprising:

  • a semiconductor substrate having a front surface and a back surface;

    a conductive via passing through the semiconductor substrate;

    a metal feature on the back surface of the semiconductor substrate and comprising;

    a metal pad overlying and contacting the conductive via; and

    a metal line over the conductive via, wherein the metal line comprises a dual damascene structure; and

    a bump overlying the metal line.

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