SYSTEM AND METHOD FOR REDUCED THERMAL RESISTANCE BETWEEN A POWER ELECTRONICS PRINTED CIRCUIT BOARD AND A BASE PLATE

• US 20110068737A1
• Filed: 09/20/2010
• Published: 03/24/2011
• Est. Priority Date: 09/24/2009
• Status: Active Grant

• Current Assignee: Lear Corporation
• Original Assignee: Lear Corporation
• Inventors: Mills, John, Rai, Rutunj, Hampo, Richard
• Granted Patent: US 8,848,375 B2
• Time in Patent Office: Days
• US Class Current: 320/107
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H05K 7/142 Spacers not being card guides
• CPC Class Codes: Y10T 29/49128 Assembling formed circuit to base

Abstract

An apparatus includes a base plate including a plurality of depressions, and a power electronics printed circuit board including a plurality traces and a plurality of high voltage components. The plurality of high voltage components is located at a plurality of locations corresponding to the plurality of depressions in the base plate. A plurality of fasteners secures the printed circuit board to the base plate with the plurality of high voltage components received at the corresponding plurality of depressions. A thermally conductive and electrically isolating interface between the base plate and the printed circuit board is made of a gap filler material conforming to the base plate and to the plurality of depressions in the base plate, and conforming to the printed circuit board and to the plurality of high voltage components.

Claims

1. An apparatus comprising:

a base plate including a plurality of depressions;

a power electronics printed circuit board including a plurality traces and a plurality of high voltage components, the plurality of high voltage components being located at a plurality of locations corresponding to the plurality of depressions in the base plate;

a plurality of fasteners securing the printed circuit board to the base plate with the plurality of high voltage components received at the corresponding plurality of depressions;

a thermally conductive and electrically isolating interface between the base plate and the printed circuit board, the interface being made of a gap filler material conforming to the base plate and to the plurality of depressions in the base plate, and conforming to the printed circuit board and to the plurality of high voltage components.

2. The apparatus of claim 1 wherein interface is formed by applying the gap filler material as a substantially liquid material that cures into a solid, such that the substantially liquid material is displaced when the printed circuit board is secured to the base plate to cause the gap filler material to conform to the base plate, the plurality of depressions, the printed circuit board, and the plurality of high voltage components.

3. The apparatus of claim 2 wherein the gap filler material is applied in two parts which are mixed and that cure into the solid.

4. The apparatus of claim 2 wherein the interface includes a substantially uniform layer of the gap filler material between the printed circuit board and the base plate.

5. The apparatus of claim 4 wherein the layer covers the plurality of high voltage components.

6. The apparatus of claim 1 wherein the interface includes a substantially uniform layer of the gap filler material between the printed circuit board and the base plate.

7. The apparatus of claim 6 wherein the layer covers the plurality of high voltage components.

8. An onboard battery charger for an automotive vehicle, the battery charger comprising:

a housing including a base plate, the base plate including a plurality of depressions;

a power electronics printed circuit board including a plurality traces and a plurality of high voltage components, the plurality of high voltage components being located at a plurality of locations corresponding to the plurality of depressions in the base plate, the printed circuit board including a battery charger circuit;

a plurality of fasteners securing the printed circuit board to the base plate with the plurality of high voltage components received at the corresponding plurality of depressions;

a thermally conductive and electrically isolating interface between the base plate and the printed circuit board, the interface being made of a gap filler material conforming to the base plate and to the plurality of depressions in the base plate, and conforming to the printed circuit board and to the plurality of high voltage components.

9. The battery charger of claim 8 wherein interface is formed by applying the gap filler material as a substantially liquid material that cures into a solid, such that the substantially liquid material is displaced when the printed circuit board is secured to the base plate to cause the gap filler material to conform to the base plate, the plurality of depressions, the printed circuit board, and the plurality of high voltage components.

10. The battery charger of claim 9 wherein the gap filler material is applied in two parts which are mixed and that cure into the solid.

11. The battery charger of claim 9 wherein the interface includes a substantially uniform layer of the gap filler material between the printed circuit board and the base plate.

12. The battery charger of claim 11 wherein the layer covers the plurality of high voltage components.

13. The battery charger of claim 8 wherein the interface includes a substantially uniform layer of the gap filler material between the printed circuit board and the base plate.

14. The battery charger of claim 13 wherein the layer covers the plurality of high voltage components.

15. The battery charger of claim 8 wherein the printed circuit board has a length of at least 6 inches and a width of at least 6 inches.

16. A method of making a power electronics apparatus, the method comprising:

providing a base plate including a plurality of depressions;

providing a power electronics printed circuit board including a plurality traces and a plurality of high voltage components, the plurality of high voltage components being located at a plurality of locations corresponding to the plurality of depressions in the base plate;

forming a thermally conductive and electrically isolating interface between the base plate and the printed circuit board, the interface being made of a gap filler material conforming to the base plate and to the plurality of depressions in the base plate, and conforming to the printed circuit board and to the plurality of high voltage components;

securing the printed circuit board to the base plate with the plurality of high voltage components received at the corresponding plurality of depressions.

17. The method of claim 16 wherein forming further comprises:

applying the gap filler material as a substantially liquid material that cures into a solid, such that the substantially liquid material is displaced when the printed circuit board is secured to the base plate to cause the gap filler material to conform to the base plate, the plurality of depressions, the printed circuit board, and the plurality of high voltage components.

18. The method of claim 17 wherein the gap filler material is applied in two parts which are mixed and that cure into the solid.

19. The method of claim 17 wherein the interface includes a substantially uniform layer of the gap filler material between the printed circuit board and the base plate.

20. The method of claim 19 wherein the layer covers the plurality of high voltage components.