SEMICONDUCTOR DEVICE, POWER CIRCUIT, AND MANUFACTURING MKETHOD OF SEMICONDUCTOR DEVICE
First Claim
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1. A semiconductor device comprising:
- a first conductive layer over a substrate;
an oxide semiconductor layer over the first conductive layer;
a second conductive layer over the oxide semiconductor layer, wherein the second conductive layer is not overlapped with the first conductive layer;
an insulating layer over the oxide semiconductor layer and the second conductive layer; and
a third conductive layer over the insulating layer, wherein the third conductive layer comprises at least a first portion which is overlapped with neither the first conductive layer nor the second conductive layer.
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Abstract
The semiconductor device includes a first conductive layer over a substrate; an oxide semiconductor layer which covers the first conductive layer; a second conductive layer in a region which is not overlapped with the first conductive layer over the oxide semiconductor layer; an insulating layer which covers the oxide semiconductor layer and the second conductive layer; and a third conductive layer in a region including at least a region which is not overlapped with the first conductive layer or the second conductive layer over the insulating layer.
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Citations
37 Claims
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1. A semiconductor device comprising:
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a first conductive layer over a substrate; an oxide semiconductor layer over the first conductive layer; a second conductive layer over the oxide semiconductor layer, wherein the second conductive layer is not overlapped with the first conductive layer; an insulating layer over the oxide semiconductor layer and the second conductive layer; and a third conductive layer over the insulating layer, wherein the third conductive layer comprises at least a first portion which is overlapped with neither the first conductive layer nor the second conductive layer. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11)
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12. A semiconductor device comprising:
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an oxide semiconductor layer over a substrate; a first conductive layer over the oxide semiconductor layer; a second conductive layer over the oxide semiconductor layer, wherein the second conductive layer is located so as not overlapped with the first conductive layer; an insulating layer over the oxide semiconductor layer, the first conductive layer, and the second conductive layer; and a third conductive layer over the insulating layer, wherein the third conductive layer comprises at least a first portion which is overlapped with neither the first conductive layer nor the second conductive layer. - View Dependent Claims (13, 14, 15, 16, 17, 18, 19, 20, 21)
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22. A method for manufacturing a semiconductor device, comprising the steps of:
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forming a first conductive layer over a substrate; forming an oxide semiconductor layer over the first conductive layer; forming a second conductive layer over the oxide semiconductor layer so as not overlapped with the first conductive layer; forming an insulating layer over the oxide semiconductor layer and the second conductive layer; forming a third conductive layer over the insulating layer, wherein the third conductive layer is formed so as to comprise at least a first portion which is overlapped with neither the first conductive layer nor the second conductive layer. - View Dependent Claims (23, 24, 25, 26, 27, 28, 29)
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30. A method for manufacturing a semiconductor device, comprising the steps of:
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forming an oxide semiconductor layer over a substrate; forming a first conductive layer over the oxide semiconductor layer; forming a second conductive layer over the oxide semiconductor layer, wherein the second conductive layer is not overlapped with the first conductive layer; forming an insulating layer over the oxide semiconductor layer, the first conductive layer, and the second conductive layer; forming a third conductive layer over the insulating layer, wherein the third conductive layer is formed so as to comprise at least a first portion which is overlapped with neither the first conductive layer nor the second conductive layer. - View Dependent Claims (31, 32, 33, 34, 35, 36, 37)
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Specification