Metrology Method and Apparatus, Lithographic Apparatus, and Device Manufacturing Method
First Claim
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1. A metrology apparatus configured to measure a property of a target on a substrate, the apparatus comprising:
- a first source configured to emit a first illumination beam of radiation;
a second source configured to emit a second illumination beam of radiation;
a beam selection device configured to select one of the first and second illumination beams of radiation as a measurement beam of radiation;
an objective lens configured to direct the measurement beam of radiation onto the target on the substrate and to collect radiation diffracted by the target; and
a sensor configured to detect an angle resolved spectrum in a pupil plane of the objective lens.
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Abstract
A metrology apparatus includes first (21) and second (22) radiation sources which generate first (iB1) and second (iB2) illumination beams of different spatial extent and/or angular range. One of the illumination beams is selected, e.g. according to the size of target to be measured. The beam selection can be made by a tillable mirror (254) at a back-projected substrate plane in a Kohler illumination setup.
118 Citations
20 Claims
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1. A metrology apparatus configured to measure a property of a target on a substrate, the apparatus comprising:
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a first source configured to emit a first illumination beam of radiation; a second source configured to emit a second illumination beam of radiation; a beam selection device configured to select one of the first and second illumination beams of radiation as a measurement beam of radiation; an objective lens configured to direct the measurement beam of radiation onto the target on the substrate and to collect radiation diffracted by the target; and a sensor configured to detect an angle resolved spectrum in a pupil plane of the objective lens. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16)
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17. A lithographic apparatus comprising:
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an illumination optical system arranged to illuminate a pattern; a projection optical system arranged to project an image of the pattern onto a substrate; and a metrology device configured to measure a property of a target on the substrate, the device comprising; a first source configured to emit a first illumination beam of radiation; a second source configured to emit a second illumination beam of radiation; a beam selection device configured to select one of the first and second illumination beams of radiation as a measurement beam of radiation; an objective lens configured to direct the measurement beam of radiation onto the target on the substrate and to collect radiation diffracted by the target; and a sensor configured to detect an angle resolved spectrum in a pupil plane of the objective lens. - View Dependent Claims (18)
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19. A method of measuring a property of a target on a substrate, the method comprising:
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generating at least one of a first or a second illumination beam, the first and second illumination beams differing in at least one of spatial extent and range of angles; selecting one of the first and second illumination beams as a measurement beam and directing the measurement beam onto the target; collecting radiation diffracted from the target using an objective lens; and detecting an angle-resolved spectrum in a pupil plane of the objective lens. - View Dependent Claims (20)
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Specification