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HEAT TREATMENT APPARATUS, HEAT TREATMENT METHOD AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

  • US 20110070692A1
  • Filed: 09/23/2010
  • Published: 03/24/2011
  • Est. Priority Date: 09/24/2009
  • Status: Active Grant
First Claim
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1. A heat treatment apparatus comprising:

  • a first chamber of which one side is opened;

    a second chamber of which one side is opened;

    a device for moving the first chamber and the second chamber;

    a heating device provided in at least one of the first chamber and the second chamber;

    a gas introduction port provided in at least one of the first chamber and the second chamber;

    a gas exhaust port provided in at least one of the first chamber and the second chamber; and

    a fixing jig of a substrate provided in at least one of the first chamber and the second chamber,wherein the open side of the first chamber and the open side of the second chamber face each other.

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