SUBSTRATE POLISHING METROLOGY USING INTERFERENCE SIGNALS
First Claim
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1. A polishing pad assembly for a chemical mechanical polishing apparatus, comprising:
- a polishing pad having a polishing surface and a surface opposite the polishing surface for attachment to a platen; and
a solid light-transmissive window formed in the polishing pad, the light-transmissive window being more transmissive to light than the polishing pad, the light-transmissive window having a light-diffusing bottom surface.
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Abstract
A polishing pad assembly for a chemical mechanical polishing apparatus includes a polishing pad having a polishing surface and a surface opposite the polishing surface for attachment to a platen, and a solid light-transmissive window formed in the polishing pad. The light-transmissive window is more transmissive to light than the polishing pad. The light-transmissive window has a light-diffusing bottom surface.
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Citations
6 Claims
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1. A polishing pad assembly for a chemical mechanical polishing apparatus, comprising:
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a polishing pad having a polishing surface and a surface opposite the polishing surface for attachment to a platen; and a solid light-transmissive window formed in the polishing pad, the light-transmissive window being more transmissive to light than the polishing pad, the light-transmissive window having a light-diffusing bottom surface. - View Dependent Claims (2, 3, 4, 5, 6)
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Specification