HEAT DISSIPATION SYSTEM

• US 20110073276A1
• Filed: 12/04/2009
• Published: 03/31/2011
• Est. Priority Date: 09/29/2009
• Status: Active Grant

• Current Assignee: Hong Fu Jin Precision Industry (Shenzhen) Co., Ltd. (Hon Hai Precision Industry Co., Ltd.), Hon Hai Precision Industry Co., Ltd.
• Original Assignee: Hong Fu Jin Precision Industry (Shenzhen) Co., Ltd. (Hon Hai Precision Industry Co., Ltd.), Hon Hai Precision Industry Co., Ltd.
• Inventors: HUANG, GUO-HE
• Granted Patent: US 8,248,783 B2
• Time in Patent Office: Days
• US Class Current: 165/47
• CPC Class Codes: G06F 1/181 Enclosures for portable computers G06F1/1613
• CPC Class Codes: G06F 1/20 Cooling means

Abstract

A heat dissipation system includes a computer case has a base plate and a back plate perpendicularly to the base plate, a heat sink, a first fan and an air duct. The heat sink is positioned in the computer case in contact with a first heat source. The first heat source and the back plate define a first air channel therebetween. The first fan is positioned in the computer case adjacent to a first side of the heat sink. The first fan is configured to generate airflow through the heat sink in such a manner that airflow flows from the computer case outside is sucked into the computer case via the first air inlet and the first air channel. The air duct is positioned in the computer case adjacent to a second side of the heat sink. The heat sink heats the airflow from the first fan. The warm airflow heated by the heat sink is then blown out of the computer case by the first fan via the air duct.

Claims

1. A heat dissipation system comprising:

a computer case comprising a base plate and a back plate perpendicularly to the base plate;

a heat sink positioned in the computer case in contact with a first heat source;

a first air channel is defined between the first heat source and the back plate;

a first fan positioned in the computer case adjacent to a first side of the heat sink, the first fan is configured to generate airflow through the heat sink in such a manner that airflow flows from the computer case outside is sucked into the computer case via the first air inlet and the first air channel; and

an air duct positioned in the computer case adjacent to a second side of the heat sink;

wherein the heat sink is capable of heating air flowing from the first fan;

the airflow heated by the heat sink is then blown out of the computer case by the first fan via the air duct.

2. The heat dissipation system of claim 1, further comprising a second heat source positioned on the base plate and a second air channel is defined between the first heat source and the second heat source;

wherein the second air channel is parallel to the first air channel.

3. The heat dissipation system of claim 2, wherein the computer case further comprises a front plate;

the base plate is attached to a motherboard;

the first heat source is positioned on the motherboard adjacent to the back plate;

the second heat source is positioned on the base plate adjacent to the front plate.

4. The heat dissipation system of claim 3, wherein the computer case further comprises a first side plate;

a first air outlet is defined in the first side plate adjacent to the air duct;

the air duct includes an air inlet opening and an air outlet opening;

the air inlet opening communicates with the second side of the heat sink;

the air outlet opening communicates with the first air outlet.

5. The heat dissipation system of claim 4, wherein a first air inlet is defined in the first side plate adjacent to the first air outlet, and the first air inlet is in communication with the first air channel.

6. The heat dissipation system of claim 5, wherein the computer case further comprises a second side plate opposite to the first side plate;

a second fan is positioned on the base plate adjacent to the second side plate;

a second air outlet is defined in the back plate adjacent to the second fan.

7. The heat dissipation system of claim 5, wherein a second air inlet is defined in the first side plate adjacent to the first air outlet, and the second air inlet is in communication with the second air channel.

8. The heat dissipation system of claim 1, wherein the air duct has a shape facilitating the air flow passing through, a size of the air outlet opening is greater than that of the air inlet opening.