LIGHT-EMITTING DIODE AND METHOD FOR MANUFACTURING THE SAME

• US 20110073894A1
• Filed: 11/29/2010
• Published: 03/31/2011
• Est. Priority Date: 03/11/2009
• Status: Abandoned Application

• Current Assignee: Chi Mei Lighting Technology Corp. (CHI MEI Corporation)
• Original Assignee: Chi Mei Lighting Technology Corp. (CHI MEI Corporation)
• Inventors: Lu, Chi Meng, Chu, Chang Hsin, Yu, Kuo Hui, Chang, Yu Ju
• Application Number:
  US12/955,369
• Publication Number:
  US 20110073894A1
• Time in Patent Office: Days
• US Class Current: 257/98
• CPC Class Codes: H01L 33/22 Roughened surfaces, e.g. at the interface between epitaxial layers
• CPC Class Codes: H01L 33/42 Transparent materials
• CPC Class Codes: H01L 33/44 characterised by the coatings, e.g. passivation layer or anti-reflective coating

Abstract

In one aspect of the invention, an LED includes a substrate, an n-type semiconductor layer, a light emitting layer, a p-type semiconductor layer and a transparent conductive layer sequentially stacked on the substrate, and p-type and n-type electrodes. The p-type semiconductor layer has a rough surface region and at least one flat surface region. The transparent conductive layer has a rough surface region and a flat surface region corresponding to the rough surface region and the at least one flat surface region of the p-type semiconductor layer, respectively. The p-type electrode is disposed on the flat surface region of the transparent conductive layer. The n-type electrode is electrically couple to the n-type semiconductor layer.

Claims

1. A light emitting diode (LED), comprising:

a substrate;

a first semiconductor layer disposed on the substrate, having a first portion and a second portion extending from each other, wherein the first portion has a rough surface region and a flat surface region recessed relative to the rough surface region;

a light emitting layer disposed on the second portion of the first semiconductor layer, defining a light emitting region thereon;

a second semiconductor layer disposed on the light emitting layer, having a rough surface region and at least one flat surface region recessed relative to the rough surface region, wherein the first semiconductor layer and the second semiconductor layer have different electrical conductivities;

an insulative layer disposed on the at least flat surface region of the second semiconductor layer;

a transparent conductive layer disposed on the insulative layer and the rough surface region of the second semiconductor layer such that the transparent conductive layer has a rough surface region and a flat surface region corresponding to the rough surface region and the at least one flat surface region of the second semiconductor layer, respectively;

a first electrode disposed on the flat surface region of the first semiconductor layer; and

a second electrode disposed on the flat surface region of the transparent conductive layer.

2. The LED of claim 1, wherein the first semiconductor layer is formed of an n-type semiconductor, and the second semiconductor layer is formed of a p-type semiconductor, and wherein the first electrode is an n-type electrode, and the second electrode is a p-type electrode.

3. The LED of claim 1, wherein the insulative layer has a thickness greater than about 5 nm.

4. The LED of claim 1, wherein the insulative layer has an area greater than the at least one flat surface region of the second semiconductor layer.

5. The LED of claim 1, wherein the insulative layer comprises a multilayer having a reflective characteristic greater than about 50%.

6. The LED of claim 5, wherein the multilayer forms a distributed Bragg reflector (DBR).

7. The LED of claim 1, wherein the insulative layer is formed of SiO₂, SiN, TiO₂ or Al₂O₃.

8. The LED of claim 1, further comprising a passivation layer disposed on the rough surface region of the transparent conductive layer and the rough surface region of the first portion of the first semiconductor.

9. A light emitting diode (LED), comprising:

a substrate;

a first semiconductor layer disposed on the substrate;

a light emitting layer disposed on the first semiconductor layer;

a second semiconductor layer disposed on the light emitting layer, having a rough surface region and at least one flat surface region, wherein the first semiconductor layer and the second semiconductor layer have different electrical conductivities;

a transparent conductive layer disposed on the second semiconductor layer such that the transparent conductive layer has a rough surface region and a flat surface region corresponding to the rough surface region and the at least one flat surface region of the second semiconductor layer, respectively;

a first electrode electrically coupled to the first semiconductor layer; and

a second electrode disposed on the flat surface region of the transparent conductive layer,

wherein in operation, no current flows vertically from the flat surface region of the transparent conductive layer to the at least one flat surface region of the second semiconductor layer.

10. The LED of claim 9, wherein the first semiconductor layer has a first portion and a second portion extending from each other, wherein the first portion has a rough surface region and a flat surface region, wherein the first electrode disposed on the flat surface region of the first portion of the first semiconductor layer, and wherein the light emitting layer disposed on the second portion of the first semiconductor layer so as to define a light emitting region thereon.

11. The LED of claim 10, wherein the flat surface region of the first semiconductor layer is recessed relative to the rough surface region of the first semiconductor layer.

12. The LED of claim 10, wherein the first semiconductor layer is formed of an n-type semiconductor, and the second semiconductor layer is formed of a p-type semiconductor, and wherein the first electrode is an n-type electrode, and the second electrode is a p-type electrode.

13. The LED of claim 12, wherein the second semiconductor layer comprises:

a p-type semiconductor layer formed on the light emitting layer; and

a p+ doped semiconductor layer formed on the rough surface region of the p-type semiconductor layer.

14. The LED of claim 13, wherein the flat surface region of the transparent conductive layer and the at least one flat surface region of the second semiconductor layer are in a Schottky contact.

15. The LED of claim 9, further comprising a reflective layer formed between the flat surface region of the transparent conductive layer and the at least one flat surface region of the second semiconductor layer.

16. The LED of claim 15, wherein the reflective layer has an area greater than the at least one flat surface region of the second semiconductor layer.

17. The LED of claim 15, wherein the reflective layer comprises an insulative layer, a stacked structure of an insulative layer and a metal layer, or a metal layer.

18. The LED of claim 15, wherein the reflective layer comprises a single layer, or a multilayer.

19. The LED of claim 15, wherein the reflective layer comprises a distributed Bragg reflector (DBR).

20. The LED of claim 9, wherein the at least one flat surface region of the second semiconductor layer is recessed relative to the rough surface region of the second semiconductor layer.

21. The LED of claim 9, further comprising a passivation layer disposed on the rough surface region of the transparent conductive layer and the rough surface region of the first portion of the first semiconductor.

22. A method of manufacturing a light emitting diode (LED), comprising the steps of:

providing a substrate;

sequentially forming an n-type semiconductor layer on the substrate, a light emitting layer on the n-type semiconductor layer, and a p-type semiconductor layer on the light emitting layer, wherein the p-type semiconductor layer has a rough surface having a first region, a second region and a third region separated from the second region;

forming a first mask layer on the first region of the rough surface of the p-type semiconductor layer, thereby exposing the second and third regions of the rough surface of the p-type semiconductor layer;

forming a second mask layer on the first mask layer and the exposed second and third regions of the rough surface of the p-type semiconductor layer, wherein the second mask layer and the p-type semiconductor layer have a substantially same etching rate, wherein the first mask layer has an etching rate less than that of the second mask layer and the p-type semiconductor layer;

performing an etching process on the second mask layer and the first mask layer so as to form a first flat surface region and a second flat surface region in the second and third regions of the p-type semiconductor layer, respectively, and to expose the rough surface of the first region of the p-type semiconductor layer;

removing a portion of the p-type semiconductor layer in which the second flat surface region is located and a corresponding portion of the light emitting layer so as to expose a portion of the n-type semiconductor layer, and forming a third flat surface region on the exposed portion of the n-type semiconductor layer;

forming a transparent conductive layer on the rough surface region and the first flat surface region of the p-type semiconductor layer, such that the transparent conductive layer has a rough surface region and a flat surface region corresponding to the rough surface region and the first flat surface region of the p-type semiconductor layer, respectively; and

forming an n-type electrode on the third flat surface region of the n-type semiconductor layer and a p-type electrode on the flat surface region of transparent conductive layer.

23. The method of claim 22, wherein each of the n-type semiconductor layer, the light emitting layer and the p-type semiconductor layer is formed of a GaN based material.

24. The method of claim 22, wherein the first mask layer is formed of SiO₂, SiNx, SiO_xN_y, BPSG, spin-on-glass (SOG), or polyimide.

25. The method of claim 22, wherein the second mask layer is formed of a photoresist (PR) material.

26. The method of claim 22, wherein the second mask layer is formed of a spin-on-glass (SOG) material.

27. The method of claim 22, wherein the etching process is performed with a dry etching process.

28. The method of claim 27, wherein the dry etching process comprises an inductively coupled plasma (ICP) process, or a reactive ion etch (RIE) process.

29. The method of claim 22, wherein the p-type semiconductor layer comprises:

a p-type semiconductor layer formed on the light emitting layer; and

a p+ doped semiconductor layer formed on the p-type semiconductor layer.

30. The method of claim 29, wherein the etching process further comprises removing the p+ doped semiconductor layer in the second and third regions of the p-type semiconductor layer.

31. The method of claim 22, wherein the flat surface region of transparent conductive layer and the first flat surface region of the second semiconductor layer are in a Schottky contact.

32. The method of claim 22, further comprising the step of forming a reflective layer between the flat surface region of the transparent conduct layer and the first flat surface region of the p-type semiconductor layer.

33. The method of claim 22, wherein the third flat surface region on the exposed portion of the n-type semiconductor layer is corresponding to the second flat surface region of the p-type semiconductor layer, and wherein the exposed portion of the n-type semiconductor layer further has a rough surface region extending from the third flat surface region.

34. The method of claim 33, further comprising the step of forming a passivation layer on the rough surface region of the exposed portion of the n-type semiconductor layer and the rough surface region of the transparent conductive layer, after forming the n-type electrode and the p-type electrode.

35. The method of claim 22, wherein the p-type semiconductor layer has at least a fourth region extending from the second region, wherein the fourth region is adapted for forming a fourth flat surface region.