STACKING DEVICES AT FINISHED PACKAGE LEVEL
First Claim
Patent Images
1. A method comprising:
- reducing a first finished package level (FPL) device having a first grounded tested die (GTD) to nearly size of the first GTD, the first FPL having a first plurality of solder balls; and
attaching the reduced first FPL device to a first substrate to form a first device assembly.
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Abstract
An embodiment is a method and apparatus to stack devices. A first finished package level (FPL) device having a first grounded tested die (GTD) is reduced to nearly size of the first GTD. The first FPL has a first plurality of solder balls. The reduced first FPL device is attached to a first substrate to form a first device assembly.
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Citations
28 Claims
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1. A method comprising:
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reducing a first finished package level (FPL) device having a first grounded tested die (GTD) to nearly size of the first GTD, the first FPL having a first plurality of solder balls; and attaching the reduced first FPL device to a first substrate to form a first device assembly. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10)
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11. An apparatus comprising:
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a reduced first finished package level (FPL) device having a first grounded tested die (GTD) and a first plurality of solder balls, the reduced first FPL device being reduced to nearly size of the first GTD; and a first substrate attached to the reduced first FPL device to form a first device assembly. - View Dependent Claims (12, 13, 14, 15, 16, 17, 18, 19, 20, 25, 26, 27, 28)
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21. A package assembly comprising:
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a first device assembly comprising; a reduced first finished package level (FPL) device having a first grounded tested die (GTD) and a first plurality of solder balls, the reduced first FPL device being reduced to nearly size of the first GTD, and a first substrate attached to the reduced first FPL device; and a second device assembly stacked on the first device assembly, the second device assembly comprising; a reduced second FPL device having a second GTD and a second plurality of solder balls, the reduced second FPL device being reduced to nearly size of the second GTD, and a second substrate attached to the reduced second FPL device. - View Dependent Claims (22, 23, 24)
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Specification