PRINTED WIRING BOARD AND MANUFACTURING METHOD THEREOF
First Claim
1. A printed wiring board configured to be connected to an organic substrate in a state where a semiconductor chip is mounted on one surface of said printed wiring board and the other surface of said printed wiring board is connected to said organic substrate, the printed wiring board comprising:
- a plurality of first layers formed of a material having the same coefficient of thermal expansion as said semiconductor chip; and
a plurality of second layers formed of a material having the same coefficient of thermal expansion as said organic substrate,wherein said first layers have different thicknesses from each other and said second layers have different thicknesses from each other;
said first layers and said second layers form a lamination by being laminated alternately one layer on another layer;
the thicknesses of said first layers decrease from a side where said semiconductor chip is mounted toward a side where said organic substrate is connected; and
the thicknesses of said second layers decrease from the side where said organic substrate is connected toward the side where said semiconductor chip is mounted.
1 Assignment
0 Petitions
Accused Products
Abstract
A printed wiring board is configured to be connected to an organic substrate in a state where a semiconductor chip is mounted thereon. A plurality of first layers are formed of a material having the same coefficient of thermal expansion as the semiconductor chip. A plurality of second layers are formed of a material having the same coefficient of thermal expansion as the organic substrate. The first layers have different thicknesses from each other and the second layers have different thicknesses from each other. The first layers and the second layers form a lamination by being laminated alternately one on another. The thicknesses of the first layers decrease from a side where the semiconductor chip is mounted toward a side where the organic substrate is connected. The thicknesses of the second layers decrease from the side where the organic substrate is connected toward the side where the semiconductor chip is mounted.
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Citations
10 Claims
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1. A printed wiring board configured to be connected to an organic substrate in a state where a semiconductor chip is mounted on one surface of said printed wiring board and the other surface of said printed wiring board is connected to said organic substrate, the printed wiring board comprising:
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a plurality of first layers formed of a material having the same coefficient of thermal expansion as said semiconductor chip; and a plurality of second layers formed of a material having the same coefficient of thermal expansion as said organic substrate, wherein said first layers have different thicknesses from each other and said second layers have different thicknesses from each other; said first layers and said second layers form a lamination by being laminated alternately one layer on another layer; the thicknesses of said first layers decrease from a side where said semiconductor chip is mounted toward a side where said organic substrate is connected; and the thicknesses of said second layers decrease from the side where said organic substrate is connected toward the side where said semiconductor chip is mounted. - View Dependent Claims (2, 3, 4, 5)
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6. A manufacturing method of a printed wiring board to be connected to an organic substrate in a state where a semiconductor chip is mounted on one surface of said printed wiring board and the other surface of said printed wiring board is connected to said organic substrate, the manufacturing method comprising:
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preparing an organic substrate core material including a concave portion having a bottom surface on which electrode wiring is formed; forming a lamination by alternately laminating a plurality of first layers having different thicknesses from each other and a plurality of second layers having different thicknesses from each other so that the thicknesses of said first layers decrease from a side where said semiconductor chip is mounted toward a side where said organic substrate is connected and the thicknesses of said second layers decrease from the side where said organic substrate is connected toward the side where said semiconductor chip is mounted; forming a first hole penetrating said lamination at a position corresponding to said electrode wiring of said organic substrate core material; forming a second hole penetrating an insulating resin filled in said first hole; and forming wiring on a surface of said insulating resin and connecting said wiring and said electrode wiring of said organic substrate core material by filling an electrically conductive material of said wiring into said second hole. - View Dependent Claims (7, 8, 9, 10)
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Specification