MANUFACTURING METHOD FOR ELECTRONIC COMPONENT, ELECTRONIC COMPONENT, AND ELECTRONIC EQUIPMENT
First Claim
1. An electronic device comprising:
- a first substrate;
a second substrate having a first surface and a second surface, the first surface facing the first substrate, the second surface being on an opposite side of the second substrate as the first surface;
an integrated circuit provided on the second surface of the second substrate;
a quartz oscillator disposed on the first surface of the second substrate, the quartz oscillator being spaced apart from the first substrate;
a sealing layer covering the first substrate and a fringe of the second substrate; and
a through-hole electrode which penetrates the second substrate and connects the quartz oscillator and the integrated circuit.
3 Assignments
0 Petitions
Accused Products
Abstract
A manufacturing method for electronic device, includes: preparing a first substrate having a plurality of first regions; preparing a second substrate having a plurality of second regions; facing the first region and the second region each other, and connecting the first substrate and the second substrate while disposing at least a part of a functional element within a space between the first region and the second region; obtaining a plurality of first divisional substrates by cutting the first substrate at each of the first regions, after the connecting of the first substrate and the second substrate; forming a sealing film covering the plurality of the first divisional substrates on the second substrate, after cutting the first substrate; obtaining a plurality of second divisional substrates by cutting the second substrate at each of the second regions, after forming the sealing film; and obtaining a plurality of individual electronic devices.
65 Citations
13 Claims
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1. An electronic device comprising:
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a first substrate; a second substrate having a first surface and a second surface, the first surface facing the first substrate, the second surface being on an opposite side of the second substrate as the first surface; an integrated circuit provided on the second surface of the second substrate; a quartz oscillator disposed on the first surface of the second substrate, the quartz oscillator being spaced apart from the first substrate; a sealing layer covering the first substrate and a fringe of the second substrate; and a through-hole electrode which penetrates the second substrate and connects the quartz oscillator and the integrated circuit. - View Dependent Claims (2, 3, 4, 5, 11, 12)
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6. An electronic device comprising:
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a first substrate having a first major surface and a second major surface; a second substrate having a first major surface and a second major surface, the first major surface of the second substrate facing the second major surface of the first substrate; an integrated circuit provided on the second major surface of the second substrate; a quartz oscillator disposed on the first major surface of the second substrate, the quartz oscillator being spaced apart from the second major surface of the first substrate; a sealing layer which directly contacts the first major surface of the first substrate and a fringe of the first major surface of the second substrate, and a through-hole electrode which penetrates the second substrate and connects the quartz oscillator and the integrated circuit. - View Dependent Claims (7, 8, 9, 10, 13)
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Specification