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MANUFACTURING METHOD FOR ELECTRONIC COMPONENT, ELECTRONIC COMPONENT, AND ELECTRONIC EQUIPMENT

  • US 20110074250A1
  • Filed: 12/07/2010
  • Published: 03/31/2011
  • Est. Priority Date: 03/01/2005
  • Status: Active Grant
First Claim
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1. An electronic device comprising:

  • a first substrate;

    a second substrate having a first surface and a second surface, the first surface facing the first substrate, the second surface being on an opposite side of the second substrate as the first surface;

    an integrated circuit provided on the second surface of the second substrate;

    a quartz oscillator disposed on the first surface of the second substrate, the quartz oscillator being spaced apart from the first substrate;

    a sealing layer covering the first substrate and a fringe of the second substrate; and

    a through-hole electrode which penetrates the second substrate and connects the quartz oscillator and the integrated circuit.

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