LIGHT-EMITTING MODULE, SELF-BALLASTED LAMP AND LIGHTING EQUIPMENT

• US 20110074291A1
• Filed: 09/20/2010
• Published: 03/31/2011
• Est. Priority Date: 09/25/2009
• Status: Active Grant

• Current Assignee: Kabushiki Kaisha Toshiba (Toshiba Corporation), Toshiba Lighting & Technology Corporation (Toshiba Corporation)
• Original Assignee: Kabushiki Kaisha Toshiba (Toshiba Corporation), Toshiba Lighting & Technology Corporation (Toshiba Corporation)
• Inventors: Araki, Tsutomu, Osawa, Shigeru, Kawano, Hitoshi, Kamata, Masahiko, Hiramatsu, Takuro
• Granted Patent: US 8,376,562 B2
• Time in Patent Office: Days
• US Class Current: 315/32
• CPC Class Codes: F21K 9/23 Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
• CPC Class Codes: F21V 17/101 permanently, e.g. welding, gluing or riveting
• CPC Class Codes: F21V 19/0055 by screwing
• CPC Class Codes: F21V 23/002 Arrangements of cables or conductors inside a lighting device, e.g. means for guiding along parts of the housing or in a pivoting arm
• CPC Class Codes: F21V 29/773 the planes containing the fins or blades having the direction of the light emitting axis
• CPC Class Codes: F21V 3/00 Globes; Bowls; Cover glasses with refracting properties F21V5/00; with reflecting properties F21V7/00; characterised by cooling arrangements F21V29/506
• CPC Class Codes: F21V 3/061 the material being glass
• CPC Class Codes: F21V 3/062 the material being plastics
• CPC Class Codes: F21Y 2115/10 Light-emitting diodes [LED]

Abstract

A light-emitting module includes a module substrate, semiconductor light-emitting elements and a connection substrate. On one face of the module substrate, a conductive layer is formed. The semiconductor light-emitting elements and the connection substrate are mounted on the conductive layer of the module substrate. Electric wires, which extend from a lighting circuit, are connected to the connection substrate. Power is supplied to the semiconductor light-emitting elements through the connection substrate and the conductive layer of the module substrate.

Claims

1. A light-emitting module comprising:

a module substrate having a conductive layer on one face side;

semiconductor light-emitting elements mounted on the conductive layer of the module substrate; and

a connection substrate which is mounted on the conductive layer of the module substrate, to which electric wires, which extend from a lighting circuit, are connected and which supplies power to the semiconductor light-emitting elements through the conductive layer.

2. The light-emitting module according to claim 1, wherein on one face of the connection substrate, electric wire connection portions to which the electric wires are connected are formed, on the other face of the connection substrate, substrate connection portions to be connected to the conductive layer of the module substrate are formed, and through-holes for connecting the electric wire connection portions and the substrate connection portions are formed in the connection substrate.

3. The light-emitting module according to claim 1, wherein an electric wire holding portion for holding the electric wires is formed in the connection substrate.

4. The light-emitting module according to claim 1, wherein the semiconductor light-emitting elements and the connection substrate are connected to the module substrate by reflow soldering.

5. A self-ballasted lamp comprising:

the light-emitting module according to claim 1;

a base body having the light-emitting module at its one end side;

a cap provided at the other end side of the base body; and

alighting circuit which is housed between the base body and the cap and has the electric wires to be connected to the connection substrate.

6. Lighting equipment comprising:

an equipment body having a socket; and

the self-ballasted lamp according to claim 5 attached to the socket of the equipment body.