Heat Sink Interface Having Three-Dimensional Tolerance Compensation
First Claim
1. A thermal interface comprising:
- a frame having first and second opposing surfaces;
a plurality of elevated regions projecting above one of the first and second opposing surfaces of said frame; and
a plurality of mechanical tolerance circuits, each of said mechanical tolerance circuits coupled between at least one of said plurality of elevated regions and said frame.
2 Assignments
0 Petitions
Accused Products
Abstract
A thermal interface includes a plurality of elevated regions and a plurality of mechanical tolerance circuits coupled to the plurality of elevated regions. The thermal interface is configured to be disposed between an array of heat generating elements and a heat sink with each of the plurality of elevated regions thermally coupled to a corresponding one or more of the array of heat generating elements. In one embodiment, the thermal interface provides a thermal path between a printed wiring board having a plurality of flip-chip circuit components disposed on an external surface thereof and a heat sink disposed over the flip-chip circuit components.
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Citations
23 Claims
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1. A thermal interface comprising:
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a frame having first and second opposing surfaces; a plurality of elevated regions projecting above one of the first and second opposing surfaces of said frame; and a plurality of mechanical tolerance circuits, each of said mechanical tolerance circuits coupled between at least one of said plurality of elevated regions and said frame. - View Dependent Claims (3, 4, 5, 6, 7, 8, 9)
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2. The thermal interface of claim 2 wherein the plurality of elevated regions and plurality of mechanical tolerance circuits are provided as like pluralities and each of said mechanical tolerance circuits are coupled between a corresponding one of said plurality of elevated regions and said frame.
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10. A system comprising:
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an array of heat generating elements; a thermal interface including a plurality of elevated regions and a plurality of mechanical tolerance circuits coupled to the plurality of elevated regions with each of the plurality of elevated regions thermally coupled to a corresponding one or more of the array of heat generating elements; and a heat sink coupled to said thermal interface such that said thermal interface is disposed between said array of heat generating elements and said heat sink. - View Dependent Claims (11, 12, 13, 14, 15, 16, 17, 18, 19, 20)
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21. A thermal interface comprising:
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a frame having first and second opposing surfaces; a first plurality of elevated regions projecting above one of the first and second opposing surfaces of said frame; a first plurality of mechanical tolerance circuits, each of the mechanical tolerance circuits coupled between at least one of said plurality of elevated regions and said frame; and a second plurality of structural ribbons, each of said second plurality of structural ribbons extending from a first end to a second opposite end of said frame and each of said second plurality of structural ribbons intersecting with a single row of said elevated regions. - View Dependent Claims (22, 23)
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Specification