Assemblies and Methods for Directly Connecting Integrated Circuits to Electrically Conductive Sheets

• US 20110075392A1
• Filed: 09/29/2009
• Published: 03/31/2011
• Est. Priority Date: 09/29/2009
• Status: Abandoned Application

• Current Assignee: Astec International Limited (Emerson Electric Company)
• Original Assignee: Astec International Limited (Emerson Electric Company)
• Inventors: Chin, Kwong Kei, Schumacher, Bradley, Weispfennig, Daryl
• Application Number:
  US12/568,941
• Publication Number:
  US 20110075392A1
• Time in Patent Office: Days
• US Class Current: 361/803
• CPC Class Codes: H01L 23/49537 Plurality of lead frames mounted in one device
• CPC Class Codes: H01L 23/49541 Geometry of the lead-frame
• CPC Class Codes: H01L 23/49568 specifically adapted to facilitate heat dissipation
• CPC Class Codes: H01L 23/49582 Metallic layers on lead frames
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H05K 1/0203 Cooling of mounted components H05K1/0272 takes precedence
• CPC Class Codes: H05K 1/0263 High current adaptations, e.g. printed high current conductors or using auxiliary non-printed means; Fine and coarse circuit patterns on one circuit board H05K1/0293 takes precedence
• CPC Class Codes: H05K 1/0298 Multilayer circuits
• CPC Class Codes: H05K 1/0313 Organic insulating material
• CPC Class Codes: H05K 1/09 Use of materials for the conductive, e.g. metallic pattern
• CPC Class Codes: H05K 1/115 Via connections; Lands around holes or via connections H05K1/112 takes precedence
• CPC Class Codes: H05K 1/181 associated with surface mounted components
• CPC Class Codes: H05K 2201/0352 Differences between the conductors of different layers of a multilayer
• CPC Class Codes: H05K 2201/09881 Coating only between conductors, i.e. flush with the conductors
• CPC Class Codes: H05K 2201/09972 Partitioned, e.g. portions of a PCB dedicated to different functions; Boundary lines therefore; Portions of a PCB being processed separately or differently
• CPC Class Codes: H05K 2201/10166 Transistor
• CPC Class Codes: H05K 2201/10689 Leaded Integrated Circuit [IC] package, e.g. dual-in-line [DIL]
• CPC Class Codes: H05K 2203/175 Configurations of connections suitable for easy deletion, e.g. modifiable circuits or temporary conductors for electroplating; Processes for deleting connections
• CPC Class Codes: H05K 3/202 using self-supporting metal foil pattern
• CPC Class Codes: H05K 3/42 : Plated through-holes or plated via connections
• CPC Class Codes: H05K 3/4602 : characterized by a special circuit board as base or central core whereon additional circuit layers are built or additional circuit boards are laminated
• CPC Class Codes: Y02P 70/50 : Manufacturing or production processes characterised by the final manufactured product
• CPC Class Codes: Y10T 29/49126 : Assembling bases

Abstract

An integrated circuit assembly includes a first electrically conductive sheet, a second electrically conductive sheet electrically isolated from the first electrically conductive sheet, a non-conductive material disposed between the first and second electrically conductive sheets, an electrical trace disposed on the non-conductive material and electrically isolated from the first and second electrically conductive sheets, and an integrated circuit having at least one lead directly connected to the first electrically conductive sheet, at least one lead directly connected to the second electrically conductive sheet, and at least one lead electrically connected to the electrical trace. Other integrated circuit assemblies and method for making integrated circuit assemblies are also disclosed.

Claims

1. An integrated circuit assembly comprising:

a first electrically conductive sheet;

a second electrically conductive sheet electrically isolated from the first electrically conductive sheet;

a non-conductive material disposed between the first and second electrically conductive sheets;

an electrical trace disposed on the non-conductive material and electrically isolated from the first and second electrically conductive sheets; and

an integrated circuit having at least one lead directly connected to the first electrically conductive sheet, at least one lead directly connected to the second electrically conductive sheet, and at least one lead electrically connected to the electrical trace.

2. The circuit assembly of claim 1, wherein the first and second electrically conductive sheets each include a copper core plated with an electrically conductive material.

3. The circuit assembly of claim 1, wherein the first electrically conductive sheet defines at least one input terminal for coupling the circuit assembly to a power source.

4. The circuit assembly of claim 3, wherein the second electrically conductive sheet defines at least one output terminal for coupling the circuit assembly to a load such that, when the integrated circuit is active, a current path is formed through the first electrically conductive sheet including the input terminal, the integrated circuit, and the second electrically conductive sheet including the output terminal.

5. The circuit assembly of claim 4, wherein the first and second electrically conductive sheets are adapted to radiate heat generated by current flow through the current path.

6. The circuit assembly of claim 4, wherein the non-conductive material separates and electrically isolates the first electrically conductive sheet from the second electrically conductive sheet.

7. The circuit assembly of claim 1, wherein the non-conductive material includes a dielectric resin.

8. The circuit assembly of claim 1, wherein the first and second electrically conductive sheets each have a thickness of at least about 0.5 millimeter.

9. The circuit assembly of claim 1, further comprising a control circuit for controlling the integrated circuit, the control circuit electrically connected to the electrical trace.

10. An integrated circuit assembly comprising:

a first electrically conductive sheet;

a second electrically conductive sheet electrically isolated from the first electrically conductive sheet;

a non-conductive material disposed between the first and second electrically conductive sheets;

a conductive via formed in at least the non-conductive material and electrically isolated from the first and second electrically conductive sheets;

an integrated circuit positioned on a first side of the electrically conductive sheets and having at least one lead directly connected to the first electrically conductive sheet, at least one lead directly connected to the second electrically conductive sheet, and at least one lead electrically connected to the conductive via;

a circuit board positioned on a second side of the electrically conductive sheets; and

at least one control circuit disposed on the circuit board and electrically connected to the conductive via for providing a control signal to the integrated circuit.

11. The circuit assembly of claim 10, wherein the integrated circuit includes a surface-mount power device, and wherein the control circuit is adapted to control the surface-mount power device to control current flow between the first electrically conductive sheet and the second electrically conductive sheet.

12. The circuit assembly of claim 11, wherein the first electrically conductive sheet defines at least one terminal for coupling the circuit assembly to a power source and the second electrically conductive sheet defines at least one terminal for coupling the circuit assembly to a load.

13. A power converter comprising the circuit assembly of claim 12.

14. The circuit assembly of claim 12, wherein the circuit board includes multiple insulated layers and multiple trace layers.

15. The circuit assembly of claim 12, wherein the first and second electrically conductive sheets each have a thickness of at least about 0.5 millimeter.

16. A method of making an integrated circuit assembly, the method comprising:

positioning a non-conductive material in an opening defined by one or more electrically conductive sheets;

forming an electrical trace on at least a portion of the non-conductive material; and

soldering at least first and second leads of an integrated circuit directly to said one electrically conductive sheet and the electrical trace, respectively.

17. The method of claim 16 wherein soldering includes soldering a third lead of the integrated circuit to a second electrically conductive sheet that is electrically isolated from said one electrically conductive sheet and the electrical trace.

18. The method of claim 16 wherein the integrated circuit is positioned on a first side of said one electrically conductive sheet, the method further comprising coupling a circuit board to a second side of said one electrically conductive sheet.

19. The method of claim 18 further comprising forming a via through the non-conductive material to electrically connect the electrical trace on the non-conductive material to at least one trace of the circuit board.

20. The method of claim 19 further comprising mounting a circuit element to the circuit board with the circuit element electrically connected to the second lead of the integrated circuit through the electrical trace on the non-conductive material, the via, and said one trace of the circuit board.