Compact Power Transformer Components, Devices, Systems and Methods
First Claim
1. A compact power transformer, comprising:
- an electrically insulating substrate comprising opposing upper and lower surfaces and an electrically insulating, non-metallic, non-semiconductor low dielectric loss material;
a power amplifier circuit configured to receive an input DC voltage and convert the DC voltage into an AC power signal;
a first transmitting coil disposed upon, in or near the upper surface;
an input impedance matching circuit having a first input operably connected to the power amplifier circuit, and a first output operably connected to the first coil;
a second receiving coil disposed upon, in or near the lower surface, andan output impedance matching circuit having a second input operably connected to the second coil, and a second output;
wherein the first coil is separated from the second coil by at least portions of the substrate, the first and second coils are spatially arranged and configured respecting one another such that the AC power signals may be transmitted by the first coil to the second coil across a dielectric barrier comprising the non-semiconductor low dielectric loss material disposed therebetween including at least portions of the substrate, the input impedance matching circuit is configured to match a first impedance of the first coil to an impedance of the power amplifier circuit, and the output impedance matching circuit is configured to match an impedance of the second coil to a second impedance of an output circuit operably connected to the second output.
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Accused Products
Abstract
Disclosed herein are various embodiments of compact coil power transformers configured to provide high voltage isolation and high voltage breakdown performance characteristics in small packages. Compact coil transformers are provided across which power may be transmitted and received by primary and secondary coils disposed on opposing sides of a substrate without high voltage breakdowns occurring therebetween. At least portions of the compact coil transformer are formed of an electrically insulating, non-metallic, non-semiconductor, low dielectric loss material. The compact coil transformers may be formed in small packages using, by way of example, printed circuit boards, flex circuits, lead frames, CMOS and other fabrication and packaging processes.
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Citations
32 Claims
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1. A compact power transformer, comprising:
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an electrically insulating substrate comprising opposing upper and lower surfaces and an electrically insulating, non-metallic, non-semiconductor low dielectric loss material; a power amplifier circuit configured to receive an input DC voltage and convert the DC voltage into an AC power signal; a first transmitting coil disposed upon, in or near the upper surface; an input impedance matching circuit having a first input operably connected to the power amplifier circuit, and a first output operably connected to the first coil; a second receiving coil disposed upon, in or near the lower surface, and an output impedance matching circuit having a second input operably connected to the second coil, and a second output; wherein the first coil is separated from the second coil by at least portions of the substrate, the first and second coils are spatially arranged and configured respecting one another such that the AC power signals may be transmitted by the first coil to the second coil across a dielectric barrier comprising the non-semiconductor low dielectric loss material disposed therebetween including at least portions of the substrate, the input impedance matching circuit is configured to match a first impedance of the first coil to an impedance of the power amplifier circuit, and the output impedance matching circuit is configured to match an impedance of the second coil to a second impedance of an output circuit operably connected to the second output. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16)
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17. A compact power transformer, comprising:
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first and second electrically insulating substrates comprising an electrically insulating, non-metallic, non-semiconductor low dielectric loss material; a power amplifier circuit configured to receive an input DC voltage and convert the DC voltage into an AC power signal; a first transmitting coil; an input impedance matching circuit having a first input operably connected to the power amplifier circuit, and a first output operably connected to the first coil; second and third receiving coils disposed above and below the first coil, at least portions of the first substrate being disposed between the first coil and the second coil, at least portions of the second substrate being disposed between the first coil and the third coil, and an output impedance matching circuit having second inputs operably connected to the second and third coils, and further comprising a second output; wherein the first coil is separated from the second and third coils by at least portions of the first and second substrates, respectively, the first, second and third coils are spatially arranged and configured respecting one another such that the AC power signals may be transmitted by the first coil to the second and third coils across first and second dielectric barriers comprising the non-semiconductor low dielectric loss material disposed therebetween including at least portions of the first and second substrates, respectively, the input impedance matching circuit is configured to match a first impedance of the first coil to an impedance of the power amplifier circuit, and the output impedance matching circuit is configured to match an impedance of the second and third coils to a second impedance of an output circuit operably connected to the second output. - View Dependent Claims (18, 19, 20, 21, 22, 23, 24, 25, 26, 27, 28, 29, 30, 31, 32)
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Specification