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MAINTAINING INTEGRITY OF PRELOADED CONTENT IN NON-VOLATILE MEMORY DURING SURFACE MOUNTING

  • US 20110075482A1
  • Filed: 09/29/2009
  • Published: 03/31/2011
  • Est. Priority Date: 09/29/2009
  • Status: Active Grant
First Claim
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1. A method for preparing a non-volatile memory chip package for surface mounting to a substrate in a surface mounting process which heats the non-volatile memory chip package, the non-volatile memory chip package comprises at least one die, the at least one die comprises a plurality of blocks of non-volatile storage elements, the method comprising:

  • preloading at least one block of the plurality of blocks with data;

    identifying at least one block of the plurality of blocks which is not preloaded with data; and

    responsive to the identifying, raising threshold voltages of non-volatile storage elements of the at least one block which is not preloaded with data, from an initial level to higher levels.

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