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MEMS MICROPHONE PACKAGE

  • US 20110075875A1
  • Filed: 01/27/2010
  • Published: 03/31/2011
  • Est. Priority Date: 09/28/2009
  • Status: Abandoned Application
First Claim
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1. A MEMS microphone package comprising:

  • a housing including a base, a sidewall extending from the base, and a cover supported by the sidewall for forming a receiving space, the housing defining an acoustic hole for receiving external sound waves;

    a MEMS die accommodated in the housing, the MEMS die defining a plurality of first conductive pads;

    a chip accommodated in the housing, the chip defining a plurality of second conductive pads;

    whereinthe housing defines a plurality of first conductive areas for electrically connecting to the first conductive pads, a plurality of second conductive areas for connecting to the second conductive pads, and a circuit embedded therein for electrically connecting the first conductive areas to the second conductive areas.

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