MEMS MICROPHONE PACKAGE
First Claim
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1. A MEMS microphone package comprising:
- a housing including a base, a sidewall extending from the base, and a cover supported by the sidewall for forming a receiving space, the housing defining an acoustic hole for receiving external sound waves;
a MEMS die accommodated in the housing, the MEMS die defining a plurality of first conductive pads;
a chip accommodated in the housing, the chip defining a plurality of second conductive pads;
whereinthe housing defines a plurality of first conductive areas for electrically connecting to the first conductive pads, a plurality of second conductive areas for connecting to the second conductive pads, and a circuit embedded therein for electrically connecting the first conductive areas to the second conductive areas.
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Abstract
A MEMS microphone package is disclosed. The MEMS microphone package comprises a housing, a MEMS die and an ASIC chip. The housing includes a base, a sidewall extending from the base, and a cover supported by the sidewall for forming a receiving space. The housing defines an acoustic hole for receiving external sound waves. The MEMS die is accommodated in the housing and the MEMS die defines a plurality of first conductive pads. The ASIC chip is accommodated in the housing and the ASIC chip defines a plurality of second conductive pads.
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Citations
12 Claims
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1. A MEMS microphone package comprising:
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a housing including a base, a sidewall extending from the base, and a cover supported by the sidewall for forming a receiving space, the housing defining an acoustic hole for receiving external sound waves; a MEMS die accommodated in the housing, the MEMS die defining a plurality of first conductive pads; a chip accommodated in the housing, the chip defining a plurality of second conductive pads;
whereinthe housing defines a plurality of first conductive areas for electrically connecting to the first conductive pads, a plurality of second conductive areas for connecting to the second conductive pads, and a circuit embedded therein for electrically connecting the first conductive areas to the second conductive areas. - View Dependent Claims (2, 3, 4, 5, 6)
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7. A method for manufacturing a MEMS microphone package, comprising the steps of:
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providing a MEMS die, a chip and a housing for accommodating the MEMS die and chip; providing the MEMS die with a plurality of first conductive pads; providing the chip with a plurality of second conductive pads; providing the housing with an acoustic hole for receiving external sound waves, a plurality of first conductive areas for electrically connecting to the first conductive pads, a plurality of second conductive areas for connecting to the second conductive pads, a base, a side wall extending from the base, a cover supported by the side wall for forming a receiving space and an circuit; electrically connecting the first conductive pads to the second conductive pads by the circuit. - View Dependent Claims (8, 9, 10, 11, 12)
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Specification