MEMS MICROPHONE PACKAGE

• US 20110075875A1
• Filed: 01/27/2010
• Published: 03/31/2011
• Est. Priority Date: 09/28/2009
• Status: Abandoned Application

• Current Assignee: AAC Acoustic Technologies (Shenzhen) Co., Ltd. (AAC Technologies Holdings Inc.), American Audio Components, Inc.
• Original Assignee: AAC Acoustic Technologies (Shenzhen) Co., Ltd. (AAC Technologies Holdings Inc.), American Audio Components, Inc.
• Inventors: WU, Zhi-Jiang, SU, Yong-Ze
• Application Number:
  US12/694,281
• Publication Number:
  US 20110075875A1
• Time in Patent Office: Days
• US Class Current: 381/361
• CPC Class Codes: B81B 2201/0257 Microphones or microspeakers
• CPC Class Codes: B81C 1/0023 Packaging together an electronic processing unit die and a micromechanical structure die MEMS packages B81B7/0032; MEMS packaging processes B81C1/00261
• CPC Class Codes: B81C 1/00238 Joining a substrate with an electronic processing unit and a substrate with a micromechanical structure

Abstract

A MEMS microphone package is disclosed. The MEMS microphone package comprises a housing, a MEMS die and an ASIC chip. The housing includes a base, a sidewall extending from the base, and a cover supported by the sidewall for forming a receiving space. The housing defines an acoustic hole for receiving external sound waves. The MEMS die is accommodated in the housing and the MEMS die defines a plurality of first conductive pads. The ASIC chip is accommodated in the housing and the ASIC chip defines a plurality of second conductive pads.

Claims

1. A MEMS microphone package comprising:

a housing including a base, a sidewall extending from the base, and a cover supported by the sidewall for forming a receiving space, the housing defining an acoustic hole for receiving external sound waves;

a MEMS die accommodated in the housing, the MEMS die defining a plurality of first conductive pads;

a chip accommodated in the housing, the chip defining a plurality of second conductive pads;

wherein

the housing defines a plurality of first conductive areas for electrically connecting to the first conductive pads, a plurality of second conductive areas for connecting to the second conductive pads, and a circuit embedded therein for electrically connecting the first conductive areas to the second conductive areas.

2. The MEMS microphone package as described in claim 1, wherein the MEMS die and the chip are both mounted on the base, and the circuit is defined in the base.

3. The MEMS microphone package as described in claim 2, wherein the acoustic hole is defined in the cover and the MEMS die includes a back volume overlapping a part of the acoustic hole.

4. The MEMS microphone package as described in claim 3 further comprising a sealing belt between the cover and the MEMS die for isolating the back volume from the receiving space.

5. The MEMS microphone package as described in claim 1, wherein the MEMS die is mounted on the cover by electrical connection between the first conductive pads and the first conductive areas, and the chip is mounted on the base by electrical connection between the second conductive pads and the conductive areas.

6. The MEMS microphone package as described in claim 1, wherein the chip is mounted on the base by electrical connection between the second conductive pads and the second conductive areas, and the MEMS die is mounted on the cover by electrical connection between the second conductive areas and the first conductive pads defined in a sealing belt located between the cover and the MEMS die, the MEMS die being provided with a back volume overlapping the acoustic hole.

7. A method for manufacturing a MEMS microphone package, comprising the steps of:

providing a MEMS die, a chip and a housing for accommodating the MEMS die and chip;

providing the MEMS die with a plurality of first conductive pads;

providing the chip with a plurality of second conductive pads;

providing the housing with an acoustic hole for receiving external sound waves, a plurality of first conductive areas for electrically connecting to the first conductive pads, a plurality of second conductive areas for connecting to the second conductive pads, a base, a side wall extending from the base, a cover supported by the side wall for forming a receiving space and an circuit;

electrically connecting the first conductive pads to the second conductive pads by the circuit.

8. The method as described in claim 7, wherein the MEMS die and the ASIC chip are both mounted on the base, and the circuit is defined in the base.

9. The method as described in claim 8, wherein the acoustic hole is defined in the cover and a back volume is defined in the MEMS die, the back volume is overlapping a part of the acoustic hole.

10. The method as described in claim 9, comprising a step of providing a sealing belt arranged between the cover and the MEMS die for isolating the back volume to the receiving space.

11. The method as described in claim 7, wherein the MEMS die is mounted on the cover by electrical connection between the first conductive pads and the first conductive areas, and the chip is mounted on the base by electrical connection between the second conductive pads and the conductive areas.

12. The method as described in claim 7, wherein the chip is mounted on the base by electrical connection between the second conductive pads and the second conductive areas, while the MEMS die is mounted on the cover by electrical connection between the second conductive areas;

and the MEMS die defines a back volume overlapping the acoustic hole, and a sealing belt is located between the cover and the MEMS die for providing the first conductive pads.