INTEGRATED FLUID PRESSURE SENSOR SYSTEM

• US 20110079085A1
• Filed: 10/06/2009
• Published: 04/07/2011
• Est. Priority Date: 10/06/2009
• Status: Abandoned Application

• Current Assignee: Eaton Corp. (Wisconsin) (Eaton Corporation PLC.)
• Original Assignee: Eaton Corp. (Wisconsin) (Eaton Corporation PLC.)
• Inventors: Dell'Eva, Mark Louis, Ambrose, Steven Lee, Kanda, Robert John
• Application Number:
  US12/574,057
• Publication Number:
  US 20110079085A1
• Time in Patent Office: Days
• US Class Current: 73/714
• CPC Class Codes: G01L 15/00 Devices or apparatus for measuring two or more fluid pressure values simultaneously
• CPC Class Codes: G01L 19/14 Housings G01L19/0007, G01L19/0084, G01L19/0092, G01L19/04, G01L19/06 take precedence
• CPC Class Codes: G01L 19/148 Details about the circuit board integration, e.g. integrated with the diaphragm surface or encapsulation
• CPC Class Codes: G01L 23/10 by pressure-sensitive members of the piezoelectric type

Abstract

An integrated fluid pressure sensor system includes a printed circuit board, a pressure manifold having a pressure source, and a sensor. The printed circuit board may be coupled to a pressure manifold. The printed circuit board and the pressure manifold may define a pressure cavity. The pressure source can be operatively configured to release fluid into the pressure cavity. The sensor may be affixed to the printed circuit board within the pressure cavity. The sealing member may be disposed between the printed circuit board and the pressure manifold. The gasket may be operatively configured to seal the pressure cavity.

Claims

1. An integrated fluid pressure sensor system comprising:

a printed circuit board coupled to a pressure manifold, the printed circuit board and the pressure manifold defining a pressure cavity, the pressure manifold including a pressure source being operatively configured to release fluid into the pressure cavity;

a sensor affixed to the printed circuit board within the pressure cavity; and

a sealing member disposed between the printed circuit board and the pressure manifold, the sealing member being operatively configured to seal the pressure cavity.

2. The integrated fluid pressure sensor system as defined in claim 1, further comprising:

a second sensor affixed to the printed circuit board;

wherein the pressure manifold and the printed circuit board define a second pressure cavity containing the second sensor, the pressure manifold including a second pressure source being operatively configured to release fluid in the second pressure cavity; and

a second sealing member disposed between the printed circuit board and the pressure manifold, the second sealing member being operatively configured to seal the second pressure cavity.

3. The integrated fluid pressure sensor system as defined in claim 1, further comprising a second polymeric material disposed on an upper surface and a lower surface of the sealing member.

4. The integrated fluid pressure sensor system as defined in claim 1, further comprising a hold down plate affixed to the printed circuit board and the pressure manifold.

5. The integrated fluid pressure sensor system as defined in claim 4, further comprising a mechanical fastener operatively configured to affix the hold down plate and the printed circuit board to the pressure manifold.

6. The integrated fluid pressure sensor system as defined in claim 2, wherein the pressure manifold is comprised of aluminum.

7. The integrated fluid pressure sensor system as defined in claim 1, wherein the sealing member is comprised of a polymeric material.

8. An integrated fluid pressure system comprising:

a printed circuit board coupled to a pressure manifold, the printed circuit board and the pressure manifold defining a pressure cavity, the pressure manifold including a pressure source being operatively configured to release fluid into the pressure cavity;

means for sensing pressure changes within the pressure cavity, the sensing means being affixed to the printed circuit board; and

means for sealing the pressure cavity, the sealing means being disposed between the printed circuit board and the pressure manifold.

9. The integrated fluid pressure system as defined in claim 8 wherein the sensing means is a small outline integrated circuit.

10. The integrated fluid pressure system as defined in claim 8 wherein the sealing means is a gasket.

11. The integrated fluid pressure system as defined in claim 8 wherein the sealing means is a seal plate.

12. The integrated fluid pressure system as defined in claim 8, further comprising a hold down plate affixed to the printed circuit board and the pressure manifold.