INTEGRATED FLUID PRESSURE SENSOR SYSTEM
First Claim
Patent Images
1. An integrated fluid pressure sensor system comprising:
- a printed circuit board coupled to a pressure manifold, the printed circuit board and the pressure manifold defining a pressure cavity, the pressure manifold including a pressure source being operatively configured to release fluid into the pressure cavity;
a sensor affixed to the printed circuit board within the pressure cavity; and
a sealing member disposed between the printed circuit board and the pressure manifold, the sealing member being operatively configured to seal the pressure cavity.
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Abstract
An integrated fluid pressure sensor system includes a printed circuit board, a pressure manifold having a pressure source, and a sensor. The printed circuit board may be coupled to a pressure manifold. The printed circuit board and the pressure manifold may define a pressure cavity. The pressure source can be operatively configured to release fluid into the pressure cavity. The sensor may be affixed to the printed circuit board within the pressure cavity. The sealing member may be disposed between the printed circuit board and the pressure manifold. The gasket may be operatively configured to seal the pressure cavity.
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Citations
12 Claims
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1. An integrated fluid pressure sensor system comprising:
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a printed circuit board coupled to a pressure manifold, the printed circuit board and the pressure manifold defining a pressure cavity, the pressure manifold including a pressure source being operatively configured to release fluid into the pressure cavity; a sensor affixed to the printed circuit board within the pressure cavity; and a sealing member disposed between the printed circuit board and the pressure manifold, the sealing member being operatively configured to seal the pressure cavity. - View Dependent Claims (2, 3, 4, 5, 6, 7)
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8. An integrated fluid pressure system comprising:
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a printed circuit board coupled to a pressure manifold, the printed circuit board and the pressure manifold defining a pressure cavity, the pressure manifold including a pressure source being operatively configured to release fluid into the pressure cavity; means for sensing pressure changes within the pressure cavity, the sensing means being affixed to the printed circuit board; and means for sealing the pressure cavity, the sealing means being disposed between the printed circuit board and the pressure manifold. - View Dependent Claims (9, 10, 11, 12)
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Specification