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INTEGRATED CIRCUIT PACKAGING SYSTEM WITH PROTECTIVE COATING AND METHOD OF MANUFACTURE THEREOF

  • US 20110079888A1
  • Filed: 09/24/2010
  • Published: 04/07/2011
  • Est. Priority Date: 10/01/2009
  • Status: Active Grant
First Claim
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1. A method of manufacture of an integrated circuit packaging system comprising:

  • forming a lead-frame having a die attach paddle and a contact pad connected by a link;

    mounting an integrated circuit die over the die attach paddle;

    molding a package body on the lead-frame and the integrated circuit die, including leaving portions of the die attach paddle, the contact pad, and the link exposed from the package body;

    forming an exposed edge by etching away the link between the contact pad and the die attach paddle; and

    depositing a solder-resistant layer on the exposed edge.

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