INTEGRATED CIRCUIT PACKAGING SYSTEM WITH PROTECTIVE COATING AND METHOD OF MANUFACTURE THEREOF

• US 20110079888A1
• Filed: 09/24/2010
• Published: 04/07/2011
• Est. Priority Date: 10/01/2009
• Status: Active Grant

• Current Assignee: Stats Chippac Pte. Ltd. (JCET Group Co., Ltd.)
• Original Assignee: Stats Chippac BVI limited (JCET Group Co., Ltd.)
• Inventors: Bathan, Henry Descalzo, Punzalan, Jeffrey D., Camacho, Zigmund Ramirez, Espiritu, Emmanuel
• Granted Patent: US 8,803,300 B2
• Time in Patent Office: Days
• US Class Current: 257/676
• CPC Class Codes: H01L 21/4832 Etching a temporary substrate after encapsulation process to form leads
• CPC Class Codes: H01L 2224/32245 the item being metallic
• CPC Class Codes: H01L 2224/45099 Material
• CPC Class Codes: H01L 2224/45124 Aluminium (Al) as principal constituent
• CPC Class Codes: H01L 2224/45144 Gold (Au) as principal constituent
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48247 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/48257 connecting the wire to a die pad of the item
• CPC Class Codes: H01L 2224/484 Connecting portions
• CPC Class Codes: H01L 2224/48599 Principal constituent of the connecting portion of the wire connector being Gold (Au)
• CPC Class Codes: H01L 2224/48624 Aluminium (Al) as principal constituent
• CPC Class Codes: H01L 2224/48639 Silver (Ag) as principal constituent
• CPC Class Codes: H01L 2224/48644 Gold (Au) as principal constituent
• CPC Class Codes: H01L 2224/48699 Principal constituent of the connecting portion of the wire connector being Aluminium (Al)
• CPC Class Codes: H01L 2224/48724 Aluminium (Al) as principal constituent
• CPC Class Codes: H01L 2224/48739 Silver (Ag) as principal constituent
• CPC Class Codes: H01L 2224/48744 Gold (Au) as principal constituent
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 2224/83 using a layer connector
• CPC Class Codes: H01L 2224/85424 Aluminium (Al) as principal constituent
• CPC Class Codes: H01L 2224/85439 : Silver (Ag) as principal constituent
• CPC Class Codes: H01L 2224/85444 : Gold (Au) as principal constituent
• CPC Class Codes: H01L 23/3107 : the device being completely enclosed
• CPC Class Codes: H01L 23/49503 : characterised by the die pad
• CPC Class Codes: H01L 23/49541 : Geometry of the lead-frame
• CPC Class Codes: H01L 23/49582 : Metallic layers on lead frames
• CPC Class Codes: H01L 24/28 : Structure, shape, material or disposition of the layer connectors prior to the connecting process
• CPC Class Codes: H01L 24/45 : of an individual wire connector
• CPC Class Codes: H01L 24/48 : of an individual wire connector
• CPC Class Codes: H01L 24/83 : using a layer connector
• CPC Class Codes: H01L 2924/00 : Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00012 : Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 : the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01013 : Aluminum [Al]
• CPC Class Codes: H01L 2924/01022 : Titanium [Ti]
• CPC Class Codes: H01L 2924/01024 : Chromium [Cr]
• CPC Class Codes: H01L 2924/01028 : Nickel [Ni]
• CPC Class Codes: H01L 2924/01029 : Copper [Cu]
• CPC Class Codes: H01L 2924/01047 : Silver [Ag]
• CPC Class Codes: H01L 2924/01075 : Rhenium [Re]
• CPC Class Codes: H01L 2924/01079 : Gold [Au]
• CPC Class Codes: H01L 2924/01082 : Lead [Pb]
• CPC Class Codes: H01L 2924/014 : Solder alloys
• CPC Class Codes: H01L 2924/078 : Adhesive characteristics other than chemical
• CPC Class Codes: H01L 2924/14 : Integrated circuits
• CPC Class Codes: H01L 2924/15747 : Copper [Cu] as principal constituent
• CPC Class Codes: H01L 2924/181 : Encapsulation

Abstract

A method of manufacture of an integrated circuit packaging system includes: forming a lead-frame having a die attach paddle and a contact pad connected by a link; mounting an integrated circuit die over the die attach paddle; molding a package body on the lead-frame and the integrated circuit die including leaving portions of the die attach paddle, the contact pad, and the link exposed from the package body; forming an exposed edge by etching away the link between the contact pad, and the die attach paddle; and depositing a solder-resistant layer on the exposed edge.

Claims

1. A method of manufacture of an integrated circuit packaging system comprising:

forming a lead-frame having a die attach paddle and a contact pad connected by a link;

mounting an integrated circuit die over the die attach paddle;

molding a package body on the lead-frame and the integrated circuit die, including leaving portions of the die attach paddle, the contact pad, and the link exposed from the package body;

forming an exposed edge by etching away the link between the contact pad and the die attach paddle; and

depositing a solder-resistant layer on the exposed edge.

2. The method as claimed in claim 1 further comprising coupling an electrical interconnect between the integrated circuit die and the contact pad.

3. The method as claimed in claim 1 further comprising forming a recess in a top surface of the lead-frame by stamping, etching, or a combination thereof.

4. The method as claimed in claim 1 wherein depositing the solder-resistant layer on the exposed edge includes depositing an oxide of metal.

5. The method as claimed in claim 1 further comprising forming a protrusion in the contact pad by etching away the link.

6. A method of manufacture of an integrated circuit packaging system comprising:

forming a lead-frame having a die attach paddle and contact pads connected by links;

patterning a solder wettable area on a bottom of the lead-frame under the contact pads and the die attach paddle;

mounting an integrated circuit die over the die attach paddle including applying and adhesive between the die attach paddle and the integrated circuit die;

molding a package body on the lead-frame and the integrated circuit die including leaving portions of the die attach paddle, the contact pads, and the links exposed from the package body;

forming an exposed edge by etching away the links between the contact pads and the die attach paddle including exposing the package body between the contact pads and the die attach paddle; and

depositing a solder-resistant layer on the exposed edge.

7. The method as claimed in claim 6 further comprising coupling electrical interconnects between the integrated circuit die and the contact pads, the die attach paddle, or a combination thereof.

8. The method as claimed in claim 6 further comprising:

forming recesses in a top surface of the lead-frame by stamping, etching, or a combination thereof for forming the links; and

wherein;

molding the package body includes filling the recesses by the package body.

9. The method as claimed in claim 6 wherein depositing the solder-resistant layer on the exposed edge includes depositing an oxide of metal or a protective coating for forming a coplanar surface with the solder wettable area.

10. The method as claimed in claim 6 further comprising forming a protrusion in the contact pads by etching away the links including forming a recess, in the lead-frame, having the protrusion in the sidewall by stamping and then etching.

11. An integrated circuit packaging system comprising:

a die attach paddle;

a contact pad adjacent to the die attach paddle;

an integrated circuit die mounted over the die attach paddle;

a package body molded on the integrated circuit die includes portions of the die attach paddle and the contact pad exposed from a bottom of the package body;

a protrusion in the contact pad adjacent to the package body with the contact pad extended below the package body; and

a solder-resistant layer on the protrusion and not on a bottom of the contact pad.

12. The system as claimed in claim 11 further comprising an electrical interconnect between the integrated circuit die and the contact pad.

13. The system as claimed in claim 11 further comprising a bonding contact on a top of the contact pad.

14. The system as claimed in claim 11 wherein the contact pad adjacent to the die attach paddle includes multiple rows of contact pads around the die attach paddle.

15. The system as claimed in claim 11 wherein the solder-resistant layer on the protrusion and not on the bottom of the contact pad includes an oxide of metal.

16. The system as claimed in claim 11 further comprising:

a solder wettable area on a bottom of the contact pad and the bottom of the die attach paddle; and

an adhesive between the integrated circuit die and a top of the die attach paddle.

17. The system as claimed in claim 16 further comprising an electrical interconnect between the integrated circuit die and the contact pad, the die attach paddle, or a combination thereof.

18. The system as claimed in claim 16 further comprising a bonding contact on a top of the contact pad and the die attach paddle.

19. The system as claimed in claim 16 wherein the contact pad adjacent to the die attach paddle includes multiple rows of contact pads around the die attach paddle.

20. The system as claimed in claim 16 wherein the solder-resistant layer on the protrusion and not on the bottom of the contact pad includes a protective coating on the protrusion and forming a coplanar surface between the solder wettable area and the protective coating.