SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME, CIRCUIT BOARD, AND ELECTRONIC INSTRUMENT
First Claim
1. A substrate comprising:
- an insulating film in which a penetrating hole is formed, the penetrating hole extending between a first surface of the insulating film and a second surface of the insulating film opposite to the first surface of the insulating film;
a wiring pattern that is adhered to the first surface of the insulating film by an adhesive material, a first portion of the wiring pattern formed over the penetrating hole, a part of the adhesive material formed on an internal wall surface forming the penetrating hole so as not to stop up the penetrating hole; and
an external electrode that contacts the first portion of the wiring pattern and projecting through the penetrating hole and extending beyond the second surface of the insulating film.
1 Assignment
0 Petitions
Accused Products
Abstract
A substrate includes an insulating film in which a penetrating hole is formed, the penetrating hole extending between a first surface of the insulating film and a second surface of the insulating film opposite to the first surface of the insulating film. A wiring pattern is adhered to the first surface of the insulating film by an adhesive material. A first portion of the wiring pattern is formed over the penetrating hole, and a part of the adhesive material is formed on an internal wall surface forming the penetrating hole so as not to stop up the penetrating hole. An external electrode contacts the first portion of the wiring pattern and projects through the penetrating hole and extends beyond the second surface of the insulating film.
32 Citations
12 Claims
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1. A substrate comprising:
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an insulating film in which a penetrating hole is formed, the penetrating hole extending between a first surface of the insulating film and a second surface of the insulating film opposite to the first surface of the insulating film; a wiring pattern that is adhered to the first surface of the insulating film by an adhesive material, a first portion of the wiring pattern formed over the penetrating hole, a part of the adhesive material formed on an internal wall surface forming the penetrating hole so as not to stop up the penetrating hole; and an external electrode that contacts the first portion of the wiring pattern and projecting through the penetrating hole and extending beyond the second surface of the insulating film. - View Dependent Claims (2, 3, 4, 5, 6)
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7. A semiconductor device comprising:
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an insulating film in which a penetrating hole is formed, the penetrating hole extending between a first surface of the insulating film and a second surface of the insulating film opposite to the first surface of the insulating film; a wiring pattern that is adhered to the first surface of the insulating film by an adhesive material, a first portion of the wiring pattern formed over the penetrating hole, a part of the adhesive material formed on an internal wall surface forming the penetrating hole so as not to stop up the penetrating hole; an external electrode that contacts the first portion of the wiring pattern and projecting through the penetrating hole and extending beyond the second surface of the insulating film; and a semiconductor chip that has an electrode electrically connected to the wiring pattern, the semiconductor chip being mounted to the first surface of the insulating film. - View Dependent Claims (8, 9, 10, 11, 12)
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Specification