MULTIBAND ANTENNA SYSTEM WITH SHIELD

• US 20110080330A1
• Filed: 10/07/2010
• Published: 04/07/2011
• Est. Priority Date: 10/07/2009
• Status: Abandoned Application

• Current Assignee: Industry-Academic Cooperation Foundation Yonsei University, Samsung Electronics Co. Ltd.
• Original Assignee: Industry-Academic Cooperation Foundation Yonsei University, Samsung Electronics Co. Ltd.
• Inventors: JEONG, Yo Han, SEO, Young Min, JEE, Yong, LEE, Joong Hee
• Application Number:
  US12/899,824
• Publication Number:
  US 20110080330A1
• Time in Patent Office: Days
• US Class Current: 343/785
• CPC Class Codes: H01Q 1/38 formed by a conductive layer on an insulating support patch antennas H01Q9/0407; microstrip dipole antennas H01Q9/065; microstrip slot antennas H01Q13/106; transmission line microstrip antennas H01Q13/206; manufacturing reflecting surfaces using insulating material for supporting the reflecting surface H01Q15/142
• CPC Class Codes: H01Q 5/55 for horn or waveguide antennas
• CPC Class Codes: H01Q 9/30 with feed to end of elongated active element, e.g. unipole H01Q9/44 takes precedence

Abstract

A multiband antenna system installed onto a circuit board of a mobile device is provided. The antenna system includes a planar dielectric substrate, an upper conductor formed on an upper surface of the dielectric substrate and shaped as a coplanar wave guide and includes first and second ground parts and a radiator, and a lower conductor formed on the lower surface of the dielectric substrate and shaped as a coplanar wave guide and includes third and fourth ground parts and an electrode part, via-holes that pass through the dielectric substrate and are electrically connected to the first ground part to the third, the second ground part to the fourth, and the radiator to the electrode part, respectively, and solder balls connect the electrode part to an electric wire of the circuit board and also the third and fourth ground parts to the ground of the circuit board.

Claims

1. An antenna system installed onto a circuit board of a mobile device, the system comprising:

a planar dielectric substrate;

an upper conductor formed on an upper surface of the dielectric substrate and shaped as a coplanar wave guide, wherein the upper conductor includes a first ground part and a second ground part and a radiator formed between the first ground part and the second ground part;

a lower conductor formed on a lower surface of the dielectric substrate and shaped as a coplanar wave guide, wherein the lower conductor includes a third ground part and a fourth ground part and a electrode part formed between the third ground part and the fourth ground part;

via-holes passing through the planar dielectric substrate, where the via-holes electrically connecting the first ground part to the third ground part, the second ground part to the fourth ground part, and the radiator to the electrode part; and

solder balls for connecting the electrode part to an electric wire of the circuit board and the third ground part and the fourth ground part to ground of the circuit board.

2. The antenna system of claim 1, wherein the dielectric substrate comprises at least one of Low Temperature Co-fired Ceramic (LTCC), ceramic, Printed Circuit Board (PCB), silicon (Si), and Gallium Arsenide (GaAs).

3. The antenna system of claim 1, wherein:

the radiator is configured such that a first pattern, a second pattern and a third pattern, which comprise a monopole radiation pattern, are connected to each other, and generates a resonant frequency based on first pattern, second pattern and third pattern lengths.

4. The antenna system of claim 3, wherein the first pattern is formed straight and parallel to the first ground part and the second ground part, according to a coplanar wave guide configuration.

5. The antenna system of claim 4, wherein the second pattern is formed straight and perpendicular to the first pattern, with respect to a certain point of the first pattern.

6. The antenna system of claim 5, wherein the second pattern forms a planar monopole radiation pattern.

7. The antenna system of claim 5, wherein the third pattern is shaped as a meander and is superimposed with the second pattern.

8. The antenna system of claim 1, further comprising:

a medium conductor comprising the same pattern as the upper conductor is located between the upper conductor and the lower conductor, and separates the planar dielectric substrate into two layers.

9. The antenna system of claim 1, wherein:

the dielectric substrate forms a groove on its lower surface on which the lower conductor is not formed;

the groove is formed on an area that is exposed; and

the groove is formed to be depressed, by a certain depth, from the lower surface of the dielectric substrate.

10. The antenna system of claim 9, wherein the groove may allow installation of circuitry that is formed on the lower surface of the circuit board.

11. The antenna system of claim 1, wherein at least one of the solder balls supports the antenna system.