POWER-ELECTRONIC ARRANGEMENT
First Claim
1. A power-electronic arrangement comprising:
- one or more semiconductor components,a heat exchanger comprising at least one evaporator channel for working fluid and at least one condenser channel for the working fluid, andan electrically conductive element comprising a contact surface providing a thermal contact to an outer surface of a wall of the evaporator channel for transferring heat from the electrically conductive element to the evaporator channel,wherein a main current terminal of each of the one or more semiconductor components is bonded to the electrically conductive element.
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Accused Products
Abstract
A power-electronic arrangement comprising semiconductor components (102, 103, 107), a heat exchanger (110), and an electrically conductive element (109) is presented. The heat exchanger comprises evaporator channels (111) and condenser channels (112) for working fluid. The electrically conductive element comprises a contact surface providing a thermal contact to outer surfaces of walls of the evaporator channels for transferring heat from the electrically conductive element to the evaporator channels. A main current terminal of each semiconductor component is bonded to the electrically conductive element which thus forms a part of a main current circuitry of a power system. As the main current terminal is directly bonded to the electrically conductive element cooled with the heat exchanger, the temperature gradients inside the semiconductor components can be kept moderate, and thus the temperatures inside the semiconductor components can be limited.
23 Citations
15 Claims
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1. A power-electronic arrangement comprising:
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one or more semiconductor components, a heat exchanger comprising at least one evaporator channel for working fluid and at least one condenser channel for the working fluid, and an electrically conductive element comprising a contact surface providing a thermal contact to an outer surface of a wall of the evaporator channel for transferring heat from the electrically conductive element to the evaporator channel, wherein a main current terminal of each of the one or more semiconductor components is bonded to the electrically conductive element. - View Dependent Claims (2, 3, 4, 5, 6, 7)
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8. An electrical converter device comprising at least one power-electronic arrangement each of which comprises:
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one or more semiconductor components, a heat exchanger comprising at least one evaporator channel for working fluid and at least one condenser channel for the working fluid, and an electrically conductive element comprising a contact surface providing a thermal contact to an outer surface of a wall of the evaporator channel for transferring heat from the electrically conductive element to the evaporator channel, wherein a main current terminal of each of the one or more semiconductor components is bonded to the electrically conductive element, and the electrically conductive element of each of at least one the power-electronic arrangement constitutes a part of a main current circuitry of the electrical converter device. - View Dependent Claims (9, 10, 11)
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12. A method for providing a cooling arrangement for one or more semiconductor components, the method comprising:
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providing at least one evaporator channel for working fluid and at least one condenser channel for the working fluid, providing a thermal contact from an electrically conductive element to an outer surface of a wall of the evaporator channel for transferring heat from the electrically conductive element to the evaporator channel, and bonding a main current terminal of each semiconductor component to the electrically conductive element. - View Dependent Claims (13, 14, 15)
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Specification