METHOD FOR GRINDING A SEMICONDUCTOR WAFER
First Claim
Patent Images
1. A method for processing a semiconductor wafer comprising:
- bringing at least one grinding tool in contact with the semiconductor wafer;
removing material from the semiconductor wafer using the grinding tool;
disposing a liquid medium having a viscosity of at least 3×
10−
3 N/m2·
s and at most 100×
10−
3 N/m2·
s between the at least one grinding tool and the semiconductor wafer; and
separating the at least one grinding tool and the semiconductor wafer so as to end the processing.
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Abstract
A method for processing a semiconductor wafer includes bringing at least one grinding tool in contact with the semiconductor wafer; removing material from the semiconductor wafer using the grinding tool; disposing a liquid medium having a viscosity of at least 3×10−3 N/m2·s and at most 100×10−3 N/m2·s between the at least one grinding tool and the semiconductor wafer; and separating the at least one grinding tool and the semiconductor wafer so as to end the processing.
21 Citations
16 Claims
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1. A method for processing a semiconductor wafer comprising:
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bringing at least one grinding tool in contact with the semiconductor wafer; removing material from the semiconductor wafer using the grinding tool; disposing a liquid medium having a viscosity of at least 3×
10−
3 N/m2·
s and at most 100×
10−
3 N/m2·
s between the at least one grinding tool and the semiconductor wafer; andseparating the at least one grinding tool and the semiconductor wafer so as to end the processing. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15)
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16. A method for processing a plurality of semiconductor wafers simultaneously comprising:
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disposing each of the plurality of semiconductor wafers in a cutout of a respective one of a plurality of carriers, each semiconductor wafer lying in a freely movable manner in a cutout in one of a plurality of carriers; rotating each of the plurality of carriers using a ring-shaped outer drive ring and a ring-shaped inner drive ring on a cycloidal trajectory; disposing the plurality of semiconductor wafers between rotating ring-shaped working disks having working layers; removing material from each of the plurality of semiconductor wafers; and disposing a liquid medium between the working disks and the plurality of semiconductor wafers via an opening in the carriers, the liquid medium having a viscosity of at least 3×
10−
3 N/m2·
s and at most 100×
10−
3 N/m2·
s.
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Specification