GAS CLUSTER ION BEAM PROCESSING METHOD FOR PREPARING AN ISOLATION LAYER IN NON-PLANAR GATE STRUCTURES

• US 20110084214A1
• Filed: 10/08/2009
• Published: 04/14/2011
• Est. Priority Date: 10/08/2009
• Status: Abandoned Application

• Current Assignee: TEL Epion Inc. (Tokyo Electron Limited)
• Original Assignee: TEL Epion Inc. (Tokyo Electron Limited)
• Inventors: Hautala, John J., Russell, Noel
• Application Number:
  US12/575,806
• Publication Number:
  US 20110084214A1
• Time in Patent Office: Days
• US Class Current: 250/396.R
• CPC Class Codes: H01J 2237/31732 Depositing thin layers on selected microareas
• CPC Class Codes: H01J 37/3178 for applying thin layers on objects
• CPC Class Codes: H01L 21/26513 of electrically active species
• CPC Class Codes: H01L 21/26566 of a cluster, e.g. using a gas cluster ion beam
• CPC Class Codes: H01L 21/26586 characterised by the angle between the ion beam and the crystal planes or the main crystal surface
• CPC Class Codes: H01L 29/66795 with a horizontal current flow in a vertical sidewall of a semiconductor body, e.g. FinFET, MuGFET
• CPC Class Codes: H01L 29/66803 with a step of doping the vertical sidewall, e.g. using tilted or multi-angled implants
• CPC Class Codes: H01L 29/785 having a channel with a horizontal current flow in a vertical sidewall of a semiconductor body, e.g. FinFET, MuGFET

Abstract

A gas cluster ion beam (GCIB) processing method for preparing an isolation layer in a non-planar gate structure is described. The method forms a non-planar gate structure on a substrate. Additionally, the GCIB processing method includes generating a GCIB formed from a material source for forming an isolation layer for the non-planar gate structure. Additionally yet, the GCIB processing method includes selecting a beam energy, a beam energy distribution, a beam focus, and a beam dose to achieve a desired thickness of the isolation layer, accelerating the GCIB to achieve the beam energy, focusing the GCIB to achieve the beam focus, and irradiating at least a portion of the substrate with the accelerated GCIB according to the beam dose. The GCIB processing method forms the isolation layer at a base surface adjacent a base of the non-planar gate structure using the GCIB to achieve the desired thickness.

Claims

1. A gas cluster ion beam (GCIB) processing method for preparing an isolation layer in a non-planar gate structure, comprising:

forming said non-planar gate structure on a substrate;

generating a GCIB formed from a material source for forming an isolation layer or said non-planar gate structure;

selecting a beam energy, a beam energy distribution, a beam focus, and a beam dose to achieve a desired thickness of said isolation layer;

accelerating said GCIB to achieve said beam energy;

focusing said GCIB to achieve said beam focus;

irradiating at least a portion of said substrate including a base surface adjacent a base of said non-planar gate structure with said accelerated GCIB according to said beam dose; and

forming said isolation layer at said base surface using said GCIB to achieve said desired thickness.

2. The GCIB processing method of claim 1, wherein said non-planar gate structure comprises a fin having a source or drain for a multi-gate field-effect transistor (MuFET), or a fin field-effect transistor (FinFET).

3. The GCIB processing method of claim 1, wherein said forming said isolation layer comprises growing and/or depositing a layer of silicon oxide (SiO_x), silicon nitride (SiN_y), or silicon oxynitride (SiO_xN_y).

4. The GCIB processing method of claim 1, wherein said non-planar gate structure comprises a fin, and said isolation layer is disposed adjacent said base of said fin.

5. The GCIB processing method of claim 4, further comprising:

forming a cap layer on a top surface of said fin using said GCIB or another GCIB.

6. The GCIB processing method of claim 4, further comprising:

adjusting a first amount of said isolation layer formed on said base surface, or a second amount of said isolation layer formed on a sidewall of said fin, or any combination of two or more thereof, by modifying said beam energy, modifying said beam energy distribution, modifying said beam focus, or modifying said beam dose, or any combination of two or more thereof.

7. The GCIB processing method of claim 4, further comprising:

maintaining a beam divergence angle for said GCIB of less than 5 degrees.

8. The GCIB processing method of claim 4, further comprising:

avoiding formation of said isolation layer on a sidewall of said fin.

9. The GCIB processing method of claim 4, further comprising:

performing an etching process to remove any material formed on a sidewall of said fin during said forming said isolation layer.

10. The GCIB processing method of claim 1, wherein said forming said isolation layer comprises oxidizing at least a portion of said substrate, and said material source comprises an oxygen-containing gas.

11. The GCIB processing method of claim 10, wherein said thickness ranges from about 3.5 nm to about 15 nm.

12. The GCIB processing method of claim 10, wherein said beam energy ranges from about 3 keV to about 10 keV.

13. The GCIB processing method of claim 10, wherein said beam energy ranges up to about 60 keV, and wherein said thickness ranges up to about 25 nm.

14. The GCIB processing method of claim 10, further comprising:

directing said GCIB along a GCIB path through an increased pressure region such that at least a portion of said GCIB path traverses said increased pressure region.

15. The GCIB processing method of claim 14, wherein said beam energy of said GCIB prior to entering said increased pressure region ranges from about 30 keV to about 60 keV.

16. The GCIB processing method of claim 14, wherein a pressure-distance integral along said at least a portion of said GCIB path ranges up to about 0.01 tom CM.

17. The GCIB processing method of claim 1, wherein said forming said isolation layer comprises depositing SiO_x on at least a portion of said substrate, and said material source comprises a silicon-containing gas and an oxygen-containing gas.

18. The GCIB processing method of claim 17, wherein said thickness ranges from about 3.5 nm to about 15 nm.

19. The GCIB processing method of claim 17, wherein said beam energy ranges from about 3 keV to about 10 keV.

20. The GCIB processing method of claim 17, wherein said beam energy ranges up to about 60 keV, and wherein said thickness ranges up to about 25 nm.

21. The GCIB processing method of claim 17, further comprising:

directing said GCIB along a GCIB path through an increased pressure region such that at least a portion of said GCIB path traverses said increased pressure region.

22. The GCIB processing method of claim 17, wherein said beam energy of said GCIB prior to entering said increased pressure region ranges from about 30 keV to about 60 keV.