Light Emitting Diode and Manufacturing Method Thereof
First Claim
Patent Images
1. A light emitting diode manufacturing method, comprising the steps of:
- providing a lead frame;
mounting at least one light emitting diode chip onto the lead frame;
forming at least one transparent enclosure to enclose the light emitting diode chip; and
disposing a mixed resin comprising at least one phosphor in an area enclosed by the transparent enclosure.
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Accused Products
Abstract
A light emitting diode manufacturing method introduces a transparent enclosure to improve the uniformity of coating phosphor, so as to achieve the purposes of enhancing the uniform color temperature and the light emitting efficiency. The manufacturing method is used extensively for packaging various types of light emitting diode chips and mass production.
37 Citations
25 Claims
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1. A light emitting diode manufacturing method, comprising the steps of:
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providing a lead frame; mounting at least one light emitting diode chip onto the lead frame; forming at least one transparent enclosure to enclose the light emitting diode chip; and disposing a mixed resin comprising at least one phosphor in an area enclosed by the transparent enclosure. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13)
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14. A light emitting diode, comprising:
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a lead frame; a light emitting diode chip mounted onto the lead frame; a transparent enclosure enclosing the light emitting diode chip; and a mixed resin containing at least one phosphor and being formed in an area enclosed by the transparent enclosure. - View Dependent Claims (15, 16, 17, 18, 19, 20, 21, 22, 23, 24, 25)
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Specification