LIGHT EMITTING DIODE DEVICE, LIGHT EMITTING APPARATUS AND METHOD OF MANUFACTURING LIGHT EMITTING DIODE DEVICE

• US 20110084300A1
• Filed: 10/13/2010
• Published: 04/14/2011
• Est. Priority Date: 10/13/2009
• Status: Active Grant

• Current Assignee: Samsung Electronics Co. Ltd.
• Original Assignee: Samsung Electronics Co. Ltd.
• Inventors: PARK, Jung Kyu
• Granted Patent: US 8,460,952 B2
• Time in Patent Office: Days
• US Class Current: 257/98
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48247 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2933/0041 relating to wavelength conversion elements
• CPC Class Codes: H01L 33/50 Wavelength conversion elements
• CPC Class Codes: H01L 33/508 having a non-uniform spatial arrangement or non-uniform concentration, e.g. patterned wavelength conversion layer, wavelength conversion layer with a concentration gradient of the wavelength conversion material
• CPC Class Codes: H01L 33/54 having a particular shape
• CPC Class Codes: H01L 33/62 Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls

Abstract

Provided is a light emitting diode device. The light emitting diode device includes a light emitting diode chip having a first surface on which first and second electrodes are disposed, and a second surface opposing the first surface, a wavelength conversion portion including fluorescent substances and covering the first surface and side surfaces of the light emitting diode chip, wherein the side surfaces denote surfaces placed between the first and second surfaces, and first and second electricity connection portions each including a plating layer, respectively connected to the first and second electrodes, and exposed to the outside of the wavelength conversion portion. Accordingly, the light emitting diode device, capable of enhancing luminous efficiency and realizing uniform product characteristics in terms of the emission of white light, is provided. Further, a process for easily and efficiently manufacturing the above light emitting diode device is provided.

Claims

1. A light emitting diode device comprising:

a light emitting diode chip having a first surface on which first and second electrodes are disposed, and a second surface opposing the first surface;

a wavelength conversion portion including fluorescent substances and covering the first surface and side surfaces of the light emitting diode chip, wherein the side surfaces refer to surfaces placed between the first and second surfaces; and

first and second electricity connection portions each including a plating layer, respectively connected to the first and second electrodes, and exposed to the outside of the wavelength conversion portion.

2. The light emitting diode device of claim 1, wherein the fluorescent substances are provided only in a region of the wavelength conversion portion covering the first surface of the light emitting diode chip.

3. The light emitting diode device of claim 1, wherein the fluorescent substances are provided in a region of the wavelength conversion portion covering the entirety of the first surface and side surfaces of the light emitting diode chip.

4. The light emitting diode device of claim 1, wherein the wavelength conversion portion is absent on the second surface of the light emitting diode chip.

5. The light emitting diode device of claim 1, wherein the fluorescent substances are absent in a region of the wavelength conversion portion placed on the first surface of the light emitting diode chip and surrounding side surfaces of the first and second electrodes.

6. A light emitting apparatus comprising:

a chip mounting portion including first and second conductors to thereby allow for the application of power thereto from the outside;

a light emitting diode device comprising;

a light emitting diode chip having a first surface on which first and second electrodes are disposed, and a second surface opposing the first surface;

a wavelength conversion portion including fluorescent substances and covering the first surface and side surfaces of the light emitting diode chip, wherein the side surfaces refer to surfaces placed between the first and second surfaces; and

first and second electricity connection portions each including a plating layer, respectively connected to the first and second electrodes, and exposed to the outside of the wavelength conversion portion; and

wires connecting the first and second electricity connection portions to the first and second conductors, respectively.

7. The light emitting apparatus of claim 6, wherein the light emitting diode device is disposed to make the second surface face the chip mounting portion.

8. The light emitting apparatus of claim 6, wherein the chip mounting portion is a circuit board.

9. A method of manufacturing a light emitting diode device, the method comprising:

preparing a fluorescent substrate including a body in which fluorescent substances are dispersed within a resin, and conductive vias penetrating the body;

disposing a light emitting diode chip, having a first surface on which first and second electrodes are formed, and a second surface opposing the first surface, such that the first and second electrodes are connected to the conductive vias; and

forming a resin portion to encapsulate at least side surfaces of the light emitting diode chip, wherein the side surfaces refer to surfaces placed between the first and second surfaces.

10. The method of claim 9, wherein the conductive vias each include a plating layer.

11. The method of claim 9, wherein the disposing of the light emitting diode chip on the fluorescent substrate is carried out so as to cause the first surface to face the fluorescent substrate.

12. The method of claim 9, further comprising underfilling a region formed by the first and second electrodes between the light emitting diode chip and the fluorescent substrate, after the disposing of the light emitting diode chip on the fluorescent substrate.

13. The method of claim 12, wherein, in the underfilling, an underfill resin including fluorescent substances is injected into the region.

14. The method of claim 9, wherein the resin portion includes fluorescent substances.

15. The method of claim 9, wherein the preparing of the fluorescent substrate comprises:

forming a pattern, having openings, on a carrier film;

forming conductive vias in the openings;

removing the pattern; and

forming fluorescent resins around the conductive vias on the carrier film.

16. The method of claim 15, further comprising removing the carrier film and exposing the conductive vias, after the forming of the resin portion.