Apparatus and Method for Through Silicon via Impedance Matching
First Claim
1. An apparatus for matching impedances in a flip-chip circuit assembly, comprising:
- a first circuit associated with a first die;
a through silicon via (TSV) coupling the first circuit to a second circuit; and
a first impedance matching inductor interposed between the TSV and the second circuit.
1 Assignment
0 Petitions
Accused Products
Abstract
Methods and apparatuses for matching impedances in a flip-chip circuit assembly are presented. An apparatus for matching impedances in a flip-chip circuit assembly may include a first circuit associated with a first die and a through silicon via (TSV) coupling the first circuit to a second circuit. The apparatus may further include a first impedance matching inductor interposed between the TSV and the second circuit. A method for matching impedances in a flip-chip circuit assembly may include providing a die having a first circuit, and forming a TSV over the die. The method may further include providing a second circuit and forming a first impedance matching inductor interposed between the TSV and second circuit.
49 Citations
34 Claims
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1. An apparatus for matching impedances in a flip-chip circuit assembly, comprising:
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a first circuit associated with a first die; a through silicon via (TSV) coupling the first circuit to a second circuit; and a first impedance matching inductor interposed between the TSV and the second circuit. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10)
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11. A method for matching impedances in a flip-chip circuit assembly, comprising:
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providing a die having a first circuit; forming a through silicon via (TSV) over the die; providing a second circuit; and forming a first impedance matching inductor interposed between the TSV and second circuit. - View Dependent Claims (12, 13, 14, 15, 16, 17, 18, 19)
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20. A method for matching impedances in a flip-chip circuit assembly, comprising:
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step for providing a die having a first circuit; step for forming a through silicon via (TSV) over the die; step for providing a second circuit; and step for forming a first impedance matching inductor interposed between the TSV and second circuit. - View Dependent Claims (21, 22, 23)
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24. An apparatus for matching impedances in a flip-chip circuit assembly, comprising:
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a first circuit associated with a first die; means for coupling the first circuit to a second circuit; and a first means for impedance matching interposed between the coupling means and the second circuit. - View Dependent Claims (25, 27, 28, 29, 30, 31, 32, 33, 34)
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Specification