PACKAGE CARRIER, SEMICONDUCTOR PACKAGE, AND PROCESS FOR FABRICATING SAME
First Claim
1. A package carrier, comprising:
- a dielectric layer having a plurality of openings;
a first conductive pattern, disposed adjacent to a first surface of the dielectric layer, the first conductive pattern including a plurality of first pads; and
a plurality of conductive vias disposed in respective ones of the openings, wherein each conductive via includes a first via segment, connected to at least one of the first pads, and a second via segment, connected to the first via segment, such that a lateral extent of the first via segment is different from a lateral extent of the second via segment.
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Accused Products
Abstract
A package carrier includes: (1) a dielectric layer; (2) a first electrically conductive pattern, embedded in the dielectric layer and disposed adjacent to a first surface of the dielectric layer, and including a plurality of first pads; (3) a plurality of first electrically conductive posts, extending through the dielectric layer, wherein each of the first electrically conductive posts includes a first electrically conductive post segment connected to at least one of the first pads and a second electrically conductive post segment connected to the first electrically conductive post segment, and a lateral extent of the first electrically conductive post segment is different from a lateral extent of the second electrically conductive post segment; and (4) a second electrically conductive pattern, disposed adjacent to a second surface of the dielectric layer, and including a plurality of second pads connected to respective ones of the second electrically conductive post segments.
124 Citations
20 Claims
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1. A package carrier, comprising:
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a dielectric layer having a plurality of openings; a first conductive pattern, disposed adjacent to a first surface of the dielectric layer, the first conductive pattern including a plurality of first pads; and a plurality of conductive vias disposed in respective ones of the openings, wherein each conductive via includes a first via segment, connected to at least one of the first pads, and a second via segment, connected to the first via segment, such that a lateral extent of the first via segment is different from a lateral extent of the second via segment. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9)
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10. A semiconductor package, comprising:
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a package carrier, including; a dielectric layer; a top conductive pattern, disposed adjacent to a top surface of the dielectric layer, and including a plurality of first pads; a bottom conductive pattern, disposed adjacent to a bottom surface of the dielectric layer, and including a plurality of second pads; and a plurality of conductive vias within the dielectric layer and extending between the top conductive pattern and the bottom conductive pattern, wherein each conductive via includes a first segment, connected to at least one of the first pads, and a second segment, connected to at least one of the second pads; and a chip, attached to the package carrier and connected to the first pads. - View Dependent Claims (11, 12, 13, 14, 15, 16, 17, 18)
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19. A semiconductor fabrication process, comprising:
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forming a first conductive pattern including a plurality of first pads; forming a plurality of first via segments on at least some of the first pads; providing a dielectric layer having a plurality of first openings corresponding to the first via segments; applying the dielectric layer to the first conductive pattern and the first via segments; forming a plurality of second openings in the dielectric layer, such that the first via segments are exposed by the second openings; and forming a plurality of second via segments on the first via segments and at least partially within the second openings, such that a diameter of the first via segment is different than a diameter of the second via segment. - View Dependent Claims (20)
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Specification