Method For Temperature Compensation In MEMS Resonators With Isolated Regions Of Distinct Material
First Claim
1. A microelectromechanical system (MEMS) resonator device, comprising:
- at least one resonating member that includes a first material having one or more trenches defined therein, each of the trenches being at least partially filled with a second material that acts to modify the thermal coefficient of frequency (TCF) of the resonator device; and
wherein the second material has a Young'"'"'s modulus temperature coefficient that is different from the Young'"'"'s modulus temperature coefficient of the first material.
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Accused Products
Abstract
MEMS resonators containing a first material and a second material to tailor the resonator'"'"'s temperature coefficient of frequency (TCF). The first material has a different Young'"'"'s modulus temperature coefficient than the second material. In one embodiment, the first material has a negative Young'"'"'s modulus temperature coefficient and the second material has a positive Young'"'"'s modulus temperature coefficient. In one such embodiment, the first material is a semiconductor and the second material is a dielectric. In a further embodiment, the quantity and location of the second material in the resonator is tailored to meet the resonator TCF specifications for a particular application. In an embodiment, the second material is isolated to a region of the resonator proximate to a point of maximum stress within the resonator. In a particular embodiment, the resonator includes a first material with a trench containing the second material.
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Citations
43 Claims
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1. A microelectromechanical system (MEMS) resonator device, comprising:
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at least one resonating member that includes a first material having one or more trenches defined therein, each of the trenches being at least partially filled with a second material that acts to modify the thermal coefficient of frequency (TCF) of the resonator device; and wherein the second material has a Young'"'"'s modulus temperature coefficient that is different from the Young'"'"'s modulus temperature coefficient of the first material. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20, 21, 22, 23, 24, 25)
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26. A method for forming a microelectromechanical system (MEMS) resonator device, the method comprising:
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providing a resonating member comprised of a first material; forming one or more trenches within the first material of the resonating member; and at least partially filling the one or more trenches with a second material that acts to modify the thermal coefficient of frequency (TCF) of the resonator device; wherein the second material has a Young'"'"'s modulus temperature coefficient that is different from the Young'"'"'s modulus temperature coefficient of the first material. - View Dependent Claims (27, 28, 29, 30, 31, 32, 33, 34, 35, 36, 37, 38, 39, 40, 41, 42, 43)
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Specification