PROCESS FOR PRODUCING SUBSTRATES FREE OF PATTERNS USING AN ALPHA STEPPER TO ENSURE RESULTS

• US 20110086444A1
• Filed: 10/14/2009
• Published: 04/14/2011
• Est. Priority Date: 10/14/2009
• Status: Abandoned Application

• Current Assignee: Taiwan Semiconductor Manufacturing Company Limited
• Original Assignee: Taiwan Semiconductor Manufacturing Company Limited
• Inventors: Weng, Wei-Chih, Huang, Hsun-Ying, Tsai, Miau Shing
• Application Number:
  US12/578,707
• Publication Number:
  US 20110086444A1
• Time in Patent Office: Days
• US Class Current: 438/16
• CPC Class Codes: H01L 27/14621 Colour filter arrangements
• CPC Class Codes: H01L 27/14627 Microlenses
• CPC Class Codes: H01L 27/1464 Back illuminated imager structures
• CPC Class Codes: H01L 27/14689 MOS based technologies

Abstract

The present disclosure provides a method for making an integrated circuit. The method comprises processing a first surface of a substrate to create the integrated circuit and grinding a second surface of the substrate to remove material until the substrate is substantially close to a desire thickness. The method also includes performing a wet etch process over the second surface of the substrate and performing a chemical mechanical polishing (CMP) process over the second surface of the substrate to remove a pattern on the substrate. The second surface of the substrate is examined with a metrological instrument to determine if the second surface is substantially smooth; if the second surface is not substantially smooth, the steps of performing the CMP process and examining the second surface with the metrological instrument are repeated until the second surface is substantially smooth.

Claims

1. A method for making an integrated circuit, comprising:

providing a substrate having a first surface and a second surface;

forming at least one circuit element on the first surface;

performing a thinning process on the second surface to remove material until the substrate is substantially close to but exceeds a first thickness, whereby the thinning process leaves a pattern on the second surface;

performing a chemical mechanical polishing (CMP) process over the substrate to substantially remove the pattern on the second surface;

analyzing the substrate after the CMP process to compare the first thickness to a second thickness; and

if the first thickness is not within a predetermined amount of the second thickness, repeating the CMP process.

2. The method of claim 1, wherein the substrate is composed of silicon.

3. The method of claim 1, wherein the thinning process comprises a mechanical grinding process.

4. The method of claim 3, wherein the thinning process further comprises a wet etching process.

5. The method of claim 1, wherein the substrate after the CMP process has been performed is configured to allow a radiation to pass through.

6. The method of claim 5, further comprising applying a radiation wavelength filter over the second surface of the substrate after the CMP process has been performed.

7. The method of claim 6, wherein the at least one circuit element is a complementary metal oxide semiconductor (CMOS) image sensor configured for detecting the radiation that passes through the filter and the second surface of the substrate.

8. A method for making an integrated circuit device, comprising:

proving a substrate having a first surface and a second surface, wherein an integrated circuit is on the first surface;

grinding the second surface of the substrate until the substrate is substantially close to a desire thickness;

performing a chemical mechanical polishing (CMP) process over the second surface of the substrate;

examining the second surface of the substrate with a metrological instrument to determine if the second surface is substantially smooth;

if the second surface is not substantially smooth, repeating the steps of performing the CMP process and examining the second surface with the metrological instrument until the second surface is substantially smooth.

9. The method of claim 8, wherein the metrological instrument is an alpha stepper .

10. The method of claim 9, wherein a quantification of a variance in surface profile provided by the alpha stepper is used to determine if the substrate is substantially smooth.

11. The method of claim 8, wherein the substrate comprises silicon.

12. The method of claim 8, wherein the substrate after the CMP process has been performed is configured to allow radiation to pass through.

13. The method of claim 12, further comprising applying a radiation filter over the second surface of the substrate to limit the wavelengths of the radiation that reach the first surface.

14. The method of claim 13, further comprising applying a lens over the second surface of the substrate.

15. The method of claim 14, further comprising laying the substrate and the visible light filter over a CMOS image sensor for detecting images in the light that passes through the lens, the filter, and the second surface of the smooth substrate.

16. A method, performed in sequence, for making a back-side illuminated complementary metal oxide semiconductor (CMOS) image sensor, comprising:

providing a substrate with at least one pixel device on a first surface;

performing a grinding process on a second surface, opposite the first surface, of the substrate until the substrate is substantially close to a desired thickness;

performing a wet etching process over the second surface of the substrate to bring it closer to the desired thickness;

performing a chemical mechanical polishing (CMP) process on the second surface of the substrate;

examining the second surface of the substrate with a profile-detection device to determine if the second surface is substantially smooth;

if the substrate is not substantially smooth, repeating the steps of performing the CMP process and examining the substrate until the substrate is substantially smooth.

17. The method of claim 16,

wherein examining the second surface of the substrate is also used to determine if the substrate is at the desired thickness, and

wherein, if the substrate is not at the desired thickness, repeating the steps of performing the CMP process and examining the substrate until the substrate is at the desired thickness.

18. The method of claim 16, wherein a quantification of a variance in surface profile provided by the profile-detection device is used to determine if the substrate is substantially smooth.

19. The method of claim 16, further comprising applying a visible light filter over the second surface of the smooth substrate to limit the wavelengths of light that pass through it.

20. The method of claim 19, further comprising forming a lens element in line with the visible light filter and the at least one pixel device.