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PROCESS FOR PRODUCING SUBSTRATES FREE OF PATTERNS USING AN ALPHA STEPPER TO ENSURE RESULTS

  • US 20110086444A1
  • Filed: 10/14/2009
  • Published: 04/14/2011
  • Est. Priority Date: 10/14/2009
  • Status: Abandoned Application
First Claim
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1. A method for making an integrated circuit, comprising:

  • providing a substrate having a first surface and a second surface;

    forming at least one circuit element on the first surface;

    performing a thinning process on the second surface to remove material until the substrate is substantially close to but exceeds a first thickness, whereby the thinning process leaves a pattern on the second surface;

    performing a chemical mechanical polishing (CMP) process over the substrate to substantially remove the pattern on the second surface;

    analyzing the substrate after the CMP process to compare the first thickness to a second thickness; and

    if the first thickness is not within a predetermined amount of the second thickness, repeating the CMP process.

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