METHOD FOR MAKING AN OPTICAL DEVICE WITH INTEGRATED OPTOELECTRONIC COMPONENTS

• US 20110086461A1
• Filed: 05/19/2009
• Published: 04/14/2011
• Est. Priority Date: 05/21/2008
• Status: Active Grant

• Current Assignee: Commissariat a L'Energie Atomique (French Alternative Energies and Atomic Energy Commission)
• Original Assignee: Energies Alternatives Commissariat A L'Energie Atomique et AUX
• Inventors: Bolis, Sebastien
• Granted Patent: US 8,124,439 B2
• Time in Patent Office: Days
• US Class Current: 438/65
• CPC Class Codes: G02B 13/001 Miniaturised objectives for electronic devices, e.g. portable telephones, webcams, PDAs, small digital cameras G02B23/243 takes precedence
• CPC Class Codes: G02B 13/0085 employing wafer level optics
• CPC Class Codes: H01L 27/14609 Pixel-elements with integrated switching, control, storage or amplification elements scanning details of imagers (circuitry of solid-state image sensors H04N25/00); circuitry of imagers H04N25/70
• CPC Class Codes: H01L 27/14618 Containers
• CPC Class Codes: H01L 27/14625 Optical elements or arrangements associated with the device
• CPC Class Codes: H01L 27/14685 Process for coatings or optical elements
• CPC Class Codes: H01L 27/14696 The active layers comprising only AIIBVI compounds, e.g. CdS, ZnS, CdTe
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H01L 31/0203 Containers; Encapsulations , e.g. encapsulation of photodiodesfor photovoltaic devices H01L31/048; for organic photosensitive devices H10K30/80
• CPC Class Codes: H01L 31/02325 the optical elements not being integrated nor being directly associated with the device
• CPC Class Codes: H04N 23/54 Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
• CPC Class Codes: H04N 23/55 Optical parts specially adapted for electronic image sensors; Mounting thereof
• CPC Class Codes: H04N 23/57 Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices

Abstract

A method for making an optical device with integrated optoelectronic components, including a) making a protective structure including a support in which at least one blind hole is made, an optical element being positioned in the blind hole, b) attaching the support to a substrate including the integrated optoelectronic components, the blind hole forming a cavity in which the optical element faces one of the optoelectronic components, c) achieving thinning of the substrate and making electric connections through the substrate, and d) making an aperture through the bottom wall of the blind hole, uncovering at least one portion of the optical field of the optical element.

Claims

1-21. -21. (canceled)

22. A method for making an optical device with integrated optoelectronic components, comprising:

a) making a protective structure comprising at least one support in which at least one blind hole is made, at least one optical element being positioned in the blind hole and attached to at least one wall of the blind hole;

b) attaching the support to a substrate comprising the integrated optoelectronic components, the blind hole forming a cavity in which the optical element faces one of the optoelectronic components;

c) performing thinning of the substrate and making electric connections through the substrate; and

d) making at least one aperture through the bottom wall of the blind hole, uncovering at least one portion of the optical field of the optical element.

23. The method according to claim 22, further comprising, during the c) performing, making electric connections between the substrate and the support and/or through the support, and/or achievement of thinning of the support.

24. The method according to claim 22, wherein the optical element comprises glass, and/or an organic material, and/or germanium.

25. The method according to claim 22, wherein the optical element includes at least one plate with parallel faces, and/or one lens, and/or one lens with an index gradient.

26. The method according to claim 22, wherein the support includes a rear face, opposite to a face configured to be attached to the substrate, substantially planar.

27. The method according to claim 22, wherein the integrated optoelectronic components include CMOS and/or CCD imagers.

28. The method according to claim 22, wherein the support comprises a material having a heat expansion coefficient substantially similar to that of the material of the substrate.

29. The method according to claim 22, wherein, during the b) attaching, the support is attached to the substrate via spacer elements.

30. The method according to claim 22, the d) making corresponds to application of thinning to the support.

31. The method according to claim 22, the a) making the protective structure comprises:

making a first stack including a first mechanical layer and a second layer comprising at least one material forming the optical element;

etching the second layer, at least one remaining portion of the second layer forming the optical element;

making a second stack including a third layer and a fourth layer;

etching at least one hole through the fourth layer;

attaching the first and second stacks, remaining portions of the fourth layer being positioned against a face of the first layer, the optical element being positioned in the hole etched through the fourth layer; and

removing the third layer.

32. The method according to claim 31, wherein removal of the third layer is obtained by totally thinning the third layer or disassembling the third layer when the third layer is attached by a temporary adhesive bonding to the fourth layer.