HEAT DISSIPATING SUBSTRATE

• US 20110088928A1
• Filed: 12/04/2009
• Published: 04/21/2011
• Est. Priority Date: 10/19/2009
• Status: Abandoned Application

• Current Assignee: Samsung Electro-Mechanics Co., Ltd. (Samsung Group)
• Original Assignee: Samsung Electro-Mechanics Co., Ltd. (Samsung Group)
• Inventors: Sohn, Young Ho, Shin, Hye Sook, LIM, Chang Hyun, Lee, Young Ki, Kim, Tae Hoon, Choi, Seog Moon
• Application Number:
  US12/631,640
• Publication Number:
  US 20110088928A1
• Time in Patent Office: Days
• US Class Current: 174/252
• CPC Class Codes: H05K 1/0262 Arrangements for regulating voltages or for using plural voltages
• CPC Class Codes: H05K 1/0263 High current adaptations, e.g. printed high current conductors or using auxiliary non-printed means; Fine and coarse circuit patterns on one circuit board H05K1/0293 takes precedence
• CPC Class Codes: H05K 1/053 the metal substrate being covered by an inorganic insulating layer
• CPC Class Codes: H05K 2201/09345 Power and ground in the same plane; Power planes for two voltages in one plane
• CPC Class Codes: H05K 2201/09509 Blind vias, i.e. vias having one side closed
• CPC Class Codes: H05K 2201/09554 Via connected to metal substrate
• CPC Class Codes: H05K 2203/0315 Oxidising metal
• CPC Class Codes: H05K 3/44 Manufacturing insulated metal core circuits or other insulated electrically conductive core circuits H05K3/0058, H05K3/4608, and H05K3/4641 take precedence
• CPC Class Codes: H05K 3/445 having insulated holes or insulated via connections through the metal core
• CPC Class Codes: H05K 3/4623 the circuit boards having internal via connections between two or more circuit layers before lamination, e.g. double-sided circuit boards H05K3/462 takes precedence
• CPC Class Codes: H05K 3/4641 having integrally laminated metal sheets or special power cores
• CPC Class Codes: H05K 7/205 Heat-dissipating body thermally connected to heat generating element via thermal paths through printed circuit board [PCB] details of PCBs relating to heat transfer H05K1/0201

Abstract

Disclosed is a heat dissipating substrate, which includes a metal plate, an insulating film formed on the surface of the metal plate, a circuit pattern formed on the insulating film, and a first via formed to pass through at least a part of the metal plate so that the metal plate and the circuit pattern are electrically connected to each other, and also which exhibits superior heat dissipation effects and enables the configuration of a circuit board to be simple due to no need to additionally provide a ground layer and a power layer.

Claims

1. A heat dissipating substrate, comprising:

a metal plate;

an insulating film formed on a surface of the metal plate;

a circuit pattern formed on the insulating film; and

a first via formed to pass through at least a part of the metal plate so that the metal plate and the circuit pattern are electrically connected to each other.

2. The heat dissipating substrate as set forth in claim 1, wherein the insulating film is formed by anodizing the metal plate.

3. The heat dissipating substrate as set forth in claim 1, wherein the metal plate is formed of a material comprising aluminum or an aluminum alloy, and the insulating film is an Al₂O₃ layer formed by anodizing the metal plate.

4. The heat dissipating substrate as set forth in claim 1, wherein the first via is formed in the metal plate, so that the circuit pattern formed on one surface of the metal plate is connected to the circuit pattern formed on the other surface of the metal plate.

5. The heat dissipating substrate as set forth in claim 1, wherein the metal plate includes a through hole having the insulating film formed on an inner wall thereof, and further includes a second via formed in the through hole, so that the circuit pattern formed on one surface of the metal plate is connected to the circuit pattern formed on the other surface of the metal plate.

6. The heat dissipating substrate as set forth in claim 1, wherein the metal plate is electrically separated into a plurality of regions by an insulating member.

7. The heat dissipating substrate as set forth in claim 6, wherein the insulating member is formed by subjecting the metal plate to volume anodizing treatment.

8. The heat dissipating substrate as set forth in claim 7, wherein the metal plate is formed of a material comprising aluminum or an aluminum alloy, and the insulating member is an Al₂O₃ layer formed by subjecting the metal plate to volume anodizing treatment.

9. The heat dissipating substrate as set forth in claim 6, wherein the metal plate separated by the insulating member includes a power region and a ground region, and the power region comprises two or more separated regions to which different magnitudes of power are applied.

10. The heat dissipating substrate as set forth in claim 6, wherein the metal plate separated by the insulating member includes a power region and a ground region, and the ground region comprises two or more separated regions.

11. A heat dissipating substrate, comprising:

a first base substrate and a second base substrate each comprising a metal plate having an insulating film formed on a surface thereof, and a first via formed to pass through at least a part of the metal plate so that circuit patterns formed on the metal plate and the insulating film are electrically connected to each other;

an insulating layer formed between the first base substrate and the second base substrate; and

a connection via formed in the insulating layer, so that circuit patterns formed on the first base substrate and the second base substrate are connected to each other,

wherein the first base substrate is connected to a ground terminal, and the second base substrate is connected to a power terminal.

12. The heat dissipating substrate as set forth in claim 11, wherein the insulating film is formed by anodizing the metal plate.

13. The heat dissipating substrate as set forth in claim 11, wherein the metal plate is formed of a material comprising aluminum or an aluminum alloy, and the insulating film is an Al₂O₃ layer formed by anodizing the metal plate.

14. The heat dissipating substrate as set forth in claim 11, wherein the first via is formed in the metal plate, so that the circuit patterns formed on both surfaces of the metal plate are connected to each other.

15. The heat dissipating substrate as set forth in claim 11, wherein the metal plate includes a through hole having the insulating film formed on an inner wall thereof, and further includes a second via formed in the through hole, so that the circuit patterns formed on both surfaces of the metal plate are connected to each other.

16. The heat dissipating substrate as set forth in claim 11, wherein the metal plate is electrically separated into a plurality of regions by an insulating member.

17. The heat dissipating substrate as set forth in claim 16, wherein the insulating member is formed by subjecting the metal plate to volume anodizing treatment.

18. The heat dissipating substrate as set forth in claim 16, wherein the metal plate is formed of a material comprising aluminum or an aluminum alloy, and the insulating member is an Al₂O₃ layer formed by subjecting the metal plate to volume anodizing treatment.