ORIENTATION OF ELECTRONIC DEVICES ON MIS-CUT SUBSTRATES
First Claim
1. A III-V nitride substrate having an (Al,Ga,In)N off-cut surface with a plurality of parallel steps, each step of the plurality of parallel steps having a first step face and a second step face meeting along a crest, wherein each first step face and each second step face is orthogonal to a cleavage plane.
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Accused Products
Abstract
A microelectronic assembly in which a semiconductor device structure is directionally positioned on an off-axis substrate. In an illustrative implementation, a laser diode is oriented on a GaN substrate wherein the GaN substrate includes a GaN (0001) surface off-cut from the <0001> direction predominantly towards either the <11
32 Citations
30 Claims
- 1. A III-V nitride substrate having an (Al,Ga,In)N off-cut surface with a plurality of parallel steps, each step of the plurality of parallel steps having a first step face and a second step face meeting along a crest, wherein each first step face and each second step face is orthogonal to a cleavage plane.
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16. A III-V nitride substrate including a III-V nitride (0001) surface off-cut from the <
- 0001>
direction predominantly towards the <
112 0>
direction and including a substrate flat, wherein the substrate flat has a flat tolerance of less than 5 degrees of azimuthal orientation. - View Dependent Claims (17, 18, 19, 20, 21, 22, 23, 24, 25, 26, 27, 28, 29, 30)
- 0001>
Specification