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Resin Solidification Substrate and Assembly

  • US 20110089610A1
  • Filed: 10/19/2010
  • Published: 04/21/2011
  • Est. Priority Date: 10/19/2009
  • Status: Active Grant
First Claim
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1. A solidification substrate assembly, comprising:

  • a rigid or semi-rigid translucent solidification substrate;

    a translucent film layer having a length;

    a film peeling member, wherein during a film peeling operation, the film peeling member traverses the length of the translucent film layer, the translucent film layer is disposed between the film peeling member and the rigid or semi-rigid translucent solidification substrate, and the film peeling member is spaced apart from the rigid or semi-rigid translucent layer by a substantially fixed distance.

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