LIGHT-EMITTING DEVICE

• US 20110089815A1
• Filed: 10/12/2010
• Published: 04/21/2011
• Est. Priority Date: 10/15/2009
• Status: Abandoned Application

• Current Assignee: Aurotek Corp.
• Original Assignee: Aurotek Corp.
• Inventors: Sun, Jui-Hung, Yeh, Cheng-Kuo
• Application Number:
  US12/902,280
• Publication Number:
  US 20110089815A1
• Time in Patent Office: Days
• US Class Current: 313/501
• CPC Class Codes: H01L 2224/45144 Gold (Au) as principal constituent
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00012 Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/181 Encapsulation
• CPC Class Codes: H01L 2933/0083 Periodic patterns for optical field-shaping in or on the semiconductor body or semiconductor body package, e.g. photonic bandgap structures
• CPC Class Codes: H01L 33/507 the elements being in intimate contact with parts other than the semiconductor body or integrated with parts other than the semiconductor body

Abstract

A light-emitting device includes a photonic crystal layer formed above a light-emitting chip and covered with a phosphor layer for diffusing light emitted from the light-emitting chip. The diffused light further excites the phosphor layer to emit colored light of multiple colors. The multiple colors are then mixed to generate white light.

Claims

1. A light-emitting device, comprising:

a substrate;

a light-emitting chip disposed on the substrate;

a packaging layer formed on the substrate for encapsulating the light-emitting chip;

a photonic crystal layer formed over the light-emitting chip corresponding in position to the light-emitting chip; and

a phosphor layer formed on the packaging layer in a manner that the packaging layer is sandwiched between the phosphor layer and the substrate.

2. The device of claim 1, wherein the light-emitting chip is a light-emitting diode (LED).

3. The device of claim 1, wherein the light-emitting chip is a blue-emitting LED.

4. The device of claim 3, wherein the phosphor layer comprises red and green phosphors.

5. The device of claim 4, wherein the phosphor layer further comprises a protective material encapsulating the phosphors.

6. The device of claim 1, wherein a surface of the packaging layer is a planar surface or a curved surface.

7. The device of claim 1, wherein the packaging layer is made of an epoxy resin or a silicone resin.

8. The device of claim 1, wherein the photonic crystal layer is directly formed on a surface of the light-emitting chip.

9. The device of claim 1, wherein the photonic crystal layer is disposed between the packaging layer and the phosphor layer.

10. The device of claim 1, wherein the photonic crystal layer comprises a plurality of nanoparticles.

11. A method for fabricating a light-emitting device, comprising the steps of:

disposing at least a light-emitting chip on a substrate;

forming a packaging layer on the substrate to encapsulate the light-emitting chip; and

forming a photonic crystal layer and a phosphor layer on the packaging layer such that the photonic crystal layer is sandwiched between the packaging layer and the phosphor layer.

12. The method of claim 11, wherein the light-emitting chip is a light-emitting diode (LED).

13. The method of claim 11, wherein the light-emitting chip is a blue light-emitting diode (LED).

14. The method of claim 13, wherein the phosphor layer comprises red and green phosphors.

15. The method of claim 14, wherein the phosphor layer further comprises a protective material encapsulating the phosphors.

16. The method of claim 11, wherein the profile of the surface of the packaging layer is planar or curved.

17. The method of claim 11, wherein the packaging layer is made of an epoxy resin or a silicone resin.

18. The method of claim 11, wherein the photonic crystal layer comprises a plurality of nanoparticles.

19. The method of claim 11, wherein the photonic crystal layer is formed on the packaging layer by imprinting.

20. The method of claim 11, wherein the photonic crystal layer is formed on the packaging layer by E-beam lithography (EBL).

21. The method of claim 11, wherein the step of forming the photonic crystal layer and the phosphor layer further comprises providing a thin film comprising the phosphor layer and the photonic crystal layer, and covering the surface of the packaging layer with the thin film such that the photonic crystal layer is sandwiched between the packaging layer and the phosphor layer.

22. The method of claim 11, wherein the method of forming the photonic crystal layer and the phosphor layer further comprises forming the photonic crystal layer on the packaging layer and forming the phosphor layer on the photonic crystal layer such that the photonic crystal layer is sandwiched between the packaging layer and the phosphor layer.

23. A method for fabricating a light-emitting device, comprising the steps of:

disposing at least a light-emitting chip on a substrate;

forming a photonic crystal layer on the surface of the light-emitting chip;

forming a packaging layer on the substrate to encapsulate the light-emitting chip and the photonic crystal layer; and

forming a phosphor layer on the packaging layer.

24. The method of claim 23, wherein the light-emitting chip is a light-emitting diode (LED).

25. The method of claim 23, wherein the light-emitting chip is a blue light-emitting diode (LED).

26. The method of claim 25, wherein the phosphor layer comprises red and green phosphors.

27. The method of claim 26, wherein the phosphor layer further comprises a protective material encapsulating the phosphors.

28. The method of claim 23, wherein a surface of the packaging layer is planar or curved.

29. The method of claim 23, wherein the packaging layer is made of an epoxy resin or a silicone resin.

30. The method of claim 23, wherein the photonic crystal layer comprises a plurality of nanoparticles.

31. The method of claim 23, wherein the photonic crystal layer is formed on the packaging layer by imprinting.

32. The method of claim 23, wherein the photonic crystal layer is formed on the packaging layer by E-beam lithography (EBL).