Element Substrate, Inspecting Method, and Manufacturing Method of Semiconductor Device

• US 20110089955A1
• Filed: 10/22/2010
• Published: 04/21/2011
• Est. Priority Date: 03/07/2005
• Status: Active Grant

• Current Assignee: Semiconductor Energy Laboratory Co., Ltd.
• Original Assignee: Semiconductor Energy Laboratory Co., Ltd.
• Inventors: Izumi, Konami, Kamata, Koichiro, Hayakawa, Masahiko, Kato, Kiyoshi
• Granted Patent: US 8,159,257 B2
• Time in Patent Office: Days
• US Class Current: 324/629
• CPC Class Codes: G01R 31/2822 of microwave or radiofrequency circuits of attenuation, gain, e.g. using network analyzers G01R27/28
• CPC Class Codes: G01R 31/2886 Features relating to contacting the IC under test, e.g. probe heads; chucks G01R31/2865 takes precedence, test connections, e.g. test sockets, or probes per se, G01R1/04 or G01R1/06
• CPC Class Codes: G01R 31/3025 Wireless interface with the DUT
• CPC Class Codes: H01L 27/13 combined with thin-film or thick-film passive components

Abstract

A substrate including a semiconductor layer, where characteristics of an element can be evaluated with high reliability, and an evaluating method thereof are provided. A substrate including a semiconductor layer of the invention has a closed-loop circuit in which an antenna coil and a semiconductor element are connected in series, and a surface of an area over which the circuit is formed is covered with an insulating film. By using such a circuit, a contactless inspection can be carried out. Further, a ring oscillator can be substituted for the closed-loop circuit.

Claims

1. -23. (canceled)

24. An inspecting method of an element substrate comprising:

applying an electromagnetic wave to the element substrate comprising a test elementary group including a closed-loop circuit in which an antenna coil and a semiconductor element are electrically connected in series; and

evaluating characteristics of the semiconductor element by measuring power absorbed by the element substrate.

25. The inspecting method of an element substrate according to claim 24, wherein the element substrate has flexibility.

26. The inspecting method of an element substrate according to claim 24, wherein the power absorbed by the element substrate is measured by a magnetic field prober.

27. The inspecting method of an element substrate according to claim 24, wherein static characteristics of the semiconductor element is evaluated in a contactless manner.

28. An inspecting method of an element substrate comprising:

applying an electromagnetic wave to the element substrate comprising an antenna coil, a ring oscillator, a power source circuit for supplying a power source voltage to the ring oscillator, and a circuit in which load modulation is carried out at an oscillation frequency of the ring oscillator; and

evaluating characteristics of the ring oscillator by measuring power absorbed by the element substrate.

29. The inspecting method of an element substrate according to claim 28, wherein the element substrate has flexibility.

30. The inspecting method of an element substrate according to claim 28, wherein the power absorbed by the element substrate is measured by a magnetic field prober.

31. The inspecting method of an element substrate according to claim 28, further comprising the steps of:

measuring an electromagnetic wave radiated from the ring oscillator.

32. The inspecting method of an element substrate according to claim 28, wherein static characteristics of the ring oscillator is evaluated in a contactless manner.