Heat Dissipation Device

• US 20110090642A1
• Filed: 08/22/2008
• Published: 04/21/2011
• Est. Priority Date: 06/03/2008
• Status: Abandoned Application

• Current Assignee: Lian Li Industrial Co., Ltd.
• Original Assignee: Lian Li Industrial Co., Ltd.
• Inventors: Chen, Deng-Hsi
• Application Number:
  US12/196,741
• Publication Number:
  US 20110090642A1
• Time in Patent Office: Days
• US Class Current: 361/679.48
• CPC Class Codes: G06F 1/206 comprising thermal management

Abstract

A heat dissipation device which is assembled in a computer case is primarily constituted by a cooling fan, a circuit drive unit, an MCU (Microcontroller Unit) chip and a light emitting unit. The MCU chip is used to detect a power load of a power supply, and the circuit drive unit is used to drive the light emitting unit to produce a change of various light colors, according to a result of detection; this allows a user to identify a power load and output of the power supply by watching directly.

Claims

1. A heat dissipation device which is assembled in a computer case, comprising a cooling fan which produces air flow after being energized;

an MCU (Microcontroller Unit) chip, which is assembled in the cooling fan and is provided with a detection end and a signal output end, with the detection end being connected to a power supply to detect a power load of the power supply and to convert a result of detection into a corresponding parametric signal; and

a circuit drive unit, which is electrically connected with the signal output end of the MCU chip to receive the parametric signal outputted by the MCU chip and to drive a light emitting unit, according to the received parametric signal, to emit light correspondingly.

2. The heat dissipation device according to claim 1, wherein the light emitting unit is a light emitting diode.

3. The heat dissipation device according to claim 1, wherein the light emitting unit is assembled at any part on physical appearance of the cooling fan.

4. The heat dissipation device according to claim 1, wherein the parametric signal is a conversion parameter corresponding to a

5. The heat dissipation device according to claim 1, wherein the parametric signal is a conversion parameter corresponding to a voltage value outputted from the power supply.

6. The heat dissipation device according to claim 1, wherein the parametric signal is a conversion parameter corresponding to an electric power value outputted from the power supply.