ELECTRONIC PACKAGE STRUCTURE

• US 20110090648A1
• Filed: 12/17/2010
• Published: 04/21/2011
• Est. Priority Date: 02/18/2008
• Status: Abandoned Application

• Current Assignee: Cyntec Co. Ltd. (Delta Electronics Incorporated)
• Original Assignee: Cyntec Co. Ltd. (Delta Electronics Incorporated)
• Inventors: CHEN, Da-Jung, WEN, Chau-Chun, LIU, Chun-Tiao
• Application Number:
  US12/971,671
• Publication Number:
  US 20110090648A1
• Time in Patent Office: Days
• US Class Current: 361/707
• CPC Class Codes: H01F 27/027 specially adapted for combination of signal type inductors or transformers with electronic circuits, e.g. mounting on printed circuit boards
• CPC Class Codes: H01F 27/29 Terminals; Tapping arrangements for signal inductances
• CPC Class Codes: H01L 2224/32225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 23/24 solid or gel at the normal operating temperature of the device H01L23/3135 takes precedence
• CPC Class Codes: H01L 23/3121 a substrate forming part of the encapsulation
• CPC Class Codes: H01L 23/552 Protection against radiation, e.g. light or electromagnetic waves
• CPC Class Codes: H01L 23/645 Inductive arrangements H01L23/647, H01L23/66 take precedence
• CPC Class Codes: H01L 24/73 Means for bonding being of different types provided for in two or more of groups H01L24/10, H01L24/18, H01L24/26, H01L24/34, H01L24/42, H01L24/50, H01L24/63, H01L24/71
• CPC Class Codes: H01L 25/16 the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00012 Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/1305 Bipolar Junction Transistor [BJT]
• CPC Class Codes: H01L 2924/13055 Insulated gate bipolar transistor [IGBT]
• CPC Class Codes: H01L 2924/13091 Metal-Oxide-Semiconductor Field-Effect Transistor [MOSFET]
• CPC Class Codes: H01L 2924/19105 in a side-by-side arrangement on a common die mounting substrate
• CPC Class Codes: H01L 2924/30107 Inductance
• CPC Class Codes: H01L 2924/3025 Electromagnetic shielding
• CPC Class Codes: H05K 1/18 Printed circuits structurally associated with non-printed electric components H05K1/0201, H05K1/023, H05K1/0243, and H05K1/16 take precedence
• CPC Class Codes: H05K 1/181 : associated with surface mounted components
• CPC Class Codes: H05K 2201/1003 : Non-printed inductor
• CPC Class Codes: H05K 2201/10515 : Stacked components
• CPC Class Codes: H05K 2201/10537 : Attached components
• CPC Class Codes: H05K 2201/10924 : Leads formed from a punched metal foil affixing a prefabricated self-supporting metal foil pattern H05K3/202
• CPC Class Codes: H05K 3/30 : Assembling printed circuits with electric components, e.g. with resistor
• CPC Class Codes: H05K 3/3421 : Leaded components
• CPC Class Codes: H05K 9/00 : Screening of apparatus or components against electric or magnetic fields devices for absorbing radiation from an antenna H01Q17/00
• CPC Class Codes: Y02P 70/50 : Manufacturing or production processes characterised by the final manufactured product
• CPC Class Codes: Y10T 29/49071 : by winding or coiling
• CPC Class Codes: Y10T 29/49146 : with encapsulating, e.g., potting, etc.

Abstract

An electronic package structure including at least one first electronic element, a second electronic element and a lead frame is provided. The second electronic element includes a body having a cavity. The first electronic element is disposed in the cavity. The lead frame has a plurality of leads. Each of the leads has a first end and a second end. The first end of at least one of the leads extends to the cavity to electrically connect the first electronic element.

Claims

1-13. -13. (canceled)

14. An electronic package, comprising:

a substrate;

at least an electronic element on top of the substrate;

a coil;

a body encapsulating at least said coil and being positioned on top of said electronic element; and

a pair of leads each having

a top end electrically coupled to a respective end of the coil,

a bottom end electrically coupled to the substrate, and

a middle section connecting said top end and said bottom end to define a bracket shape.

15. An electronic package as claimed in claim 14, wherein the electronic element is disposed on a top face of the substrate between the bottom ends of the leads.

16. An electronic package as claimed in claim 14, wherein said middle section of each said lead is entirely exposed out of said body.

17. An electronic package as claimed in claim 14, wherein said top end of each said lead is at least partially embedded in the body.

18. An electronic package as claimed in claim 14, wherein said substrate includes

first and second conductive layers on opposite top and bottom faces of said substrate;

and

at least one conductive via penetrating the substrate to electrically connect the first and second conductive layers;

wherein said conductive via is disposed immediately under the electronic element for dissipating heat generated by said electronic element away.

19. An electronic package as claimed in claim 14, further comprising:

an insulating encapsulant encapsulating the electronic element and disposed under the body.

20. An electronic package as claimed in claim 19, wherein a width of said encapsulant is smaller than that of said body.

21. An electronic package as claimed in claim 20, wherein said encapsulant is disposed between the bottom ends of the leads.

22. An electronic package as claimed in claim 14, wherein the top end and bottom end of each said lead are positioned in parallel planes and the middle section of said lead is perpendicular to the top end and the bottom end.

23. An electronic package as claimed in claim 14, wherein said electronic element is one selected from the group consisting of a capacitor, a resistor, and an inductor with a smaller inductance than the coil.

24. An electronic package as claimed in claim 14, wherein said electronic element is one selected from the group consisting of a metal-oxide-semiconductor field effect transistor (MOSFET), an insulated gate bipolar transistor (IGBT), and a diode.

25. An electronic package as claimed in claim 14, comprising multiple said electronic elements disposed under the body and between the bottom ends of the leads.

26. An electronic package as claimed in claim 14, further comprising:

an electromagnetic-interference (EMI) shielding element between the coil and the electronic element.

27. An electronic package as claimed in claim 26, further comprising

an insulating encapsulant encapsulating the electronic element and disposed under the body;

wherein the EMI shielding element is embedded in the encapsulant.

28. An electronic package as claimed in claim 26, wherein the EMI shielding element is embedded in the body.

29. An electronic package as claimed in claim 28, wherein the body includes a magnetic wrap that wraps the coil.