LAMP ASSEMBLIES AND METHODS OF MAKING THE SAME

• US 20110090691A1
• Filed: 10/15/2009
• Published: 04/21/2011
• Est. Priority Date: 10/15/2009
• Status: Active Grant

• Current Assignee: IDEAL Industries Lighting, LLC (Ideal Industries Incorporated)
• Original Assignee: CREE Incorporated (Wolfspeed, Inc.)
• Inventors: Higley, Robert Edward, Markle, Joshua Josiah
• Granted Patent: US 8,602,593 B2
• Time in Patent Office: Days
• US Class Current: 362/249.02
• CPC Class Codes: F21K 9/00 Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
• CPC Class Codes: F21V 19/0055 by screwing
• CPC Class Codes: F21V 29/76 with essentially identical parallel planar fins or blades, e.g. with comb-like cross-section
• CPC Class Codes: F21V 29/763 the planes containing the fins or blades having the direction of the light emitting axis
• CPC Class Codes: F21V 29/85 characterised by the material liquid coolants F21V29/56
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 25/0753 the devices being arranged next to each other
• CPC Class Codes: H01L 2924/19107 off-chip wires
• CPC Class Codes: H05K 1/021 Components thermally connected to metal substrates or heat-sinks by insert mounting
• CPC Class Codes: H05K 2201/0311 Metallic part with specific elastic properties, e.g. bent piece of metal as electrical contact
• CPC Class Codes: H05K 2201/09163 Slotted edge
• CPC Class Codes: H05K 2201/10106 Light emitting diode [LED]
• CPC Class Codes: H05K 2201/10287 Metal wires as connectors or conductors
• CPC Class Codes: H05K 2201/10409 Screws
• CPC Class Codes: H05K 3/0058 Laminating printed circuit boards onto other substrates, e.g. metallic substrates H05K1/0281 takes precedence
• CPC Class Codes: H05K 3/32 electrically connecting electric components or wires to printed circuits
• CPC Class Codes: H05K 3/325 by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor adaptations of leads inserted in holes for press-fit connections H05K3/308

Abstract

Lamp assemblies and methods of making the same are provided. Such a lamp assembly can include a heat sink and a light-emitting diode package that can be mounted to the heat sink. The light-emitting diode package can include a substrate with a top surface and bottom surface, a lens, and electrical contacts on the surface of the substrate. The lamp assembly can also include a printed circuit board with a face surface, a rear surface opposite the face surface and an opening extending from the face surface to the rear surface. The printed circuit board can have electrical contacts thereon for electrical connection with the electrical contacts of the light-emitting diode package. The substrate of the light-emitting diode package can engage the opening of the printed circuit board to mechanically couple the light-emitting diode package to the printed circuit board. When assembled, a bottom surface of the substrate can be flush and aligned with a rear surface of the printed circuit board.

Claims

1. A lamp assembly comprising:

a heat sink;

at least one light-emitting diode package mounted to the heat sink, the light-emitting diode package comprising a substrate and electrical contacts;

a board comprising a face surface, a rear surface opposite the face surface and an opening extending from the face surface to the rear surface, the board comprising electrical contacts for electrical connection with the electrical contacts of the light-emitting diode package, and

the substrate of the light-emitting diode package engaging the opening of the board to mechanically couple the light-emitting diode package to the board.

2. The lamp assembly according to claim 1, wherein the substrate of the light-emitting diode package comprises a top surface and a bottom surface.

3. The lamp assembly according to claim 2, wherein the electrical contacts of the light-emitting diode package are disposed only on the top surface of the substrate.

4. The lamp assembly according to claim 1, wherein the substrate of the light-emitting diode package is mounted to the heat sink with a thermally conductive compound.

5. The lamp assembly according to claim 1, wherein a shape of the opening in the board corresponds to a shape of the substrate of the light-emitting diode package.

6. The lamp assembly according to claim 5, wherein sides of the substrate of the light-emitting diode package frictionally engage inner walls of the board defining the opening therein.

7. The lamp assembly according to claim 1, wherein the board comprises a printed circuit board.

8. The lamp assembly according to claim 1, wherein the electrical contacts of the board are disposed on the face surface of the board and electrical connection between the board and the light-emitting diode package is made by wires reflowed between the electrical contacts of the board and the electrical contacts of the light-emitting diode package on a top-side of the lamp assembly.

9. The lamp assembly according to claim 1, wherein the electrical contacts of the board comprise spring contacts that are disposed on the face surface of the board and extend into the opening of the board, and electrical connection between the board and the light-emitting diode package is made by contact of the spring contacts of the board and the electrical contacts of the light-emitting diode package.

10. The lamp assembly according to claim 9, wherein the board comprises one or more spring clips that are disposed on the face surface of the board and extend into the opening of the board, where the spring clips facilitate retention of the light-emitting diode package in the opening of the board.

11. The lamp assembly according to claim 1, wherein the substrate of the light-emitting diode package comprises a lens.

12. The lamp assembly according to claim 11, wherein a shape of the opening through the face surface of the board corresponds to a shape of a base of the lens of the light-emitting diode package and the board defines a recess on the rear surface of the board that forms a portion of the opening with the recess corresponding to a shape of the substrate of the light-emitting diode package.

13. The lamp assembly according to claim 12, wherein sides of the substrate of the light-emitting diode package frictionally engage inner walls of the board defining the recess so that only the lens extends above the face surface of the board.

14. The lamp assembly according to claim 12, wherein the electrical contacts of the board are disposed within the recess of the board and electrical connection between the board and the light-emitting diode package is made by contact between the electrical contacts of the board and the electrical contacts of the light-emitting diode package on a top surface of the substrate of the light-emitting diode package.

15. The lamp assembly according to claim 14, wherein the electrical contacts on the board comprise at least one of pogo pins, solder balls, spikes, and electrical receptacles.

16. The lamp assembly according to claim 1, wherein the board further comprises one or more larger electrical contacts.

17. The lamp assembly according to claim 1, wherein the board comprises one or more via holes with a thermal conductive material running therethrough with a plate of the thermal conductive material being positioned over the via holes on both the face surface and the rear surface of the board.

18. The lamp assembly according to claim 1, wherein the board and the heat sink are secured together.

19. The lamp assembly according to claim 18, wherein the board and the heat sink each comprise one or more securement holes that are alignable with each other and further comprising one or more attachment devices configured for insertion into the aligned securement holes to hold the board to the heat sink.

20. The lamp assembly according to claim 19, wherein the one or more attachment devices are selected from the group consisting of screws, bolts, and rivets.

21. The lamp assembly according to claim 18, wherein the board and the heat sink are secured together by an epoxy placed between the board and the heat sink.

22. The lamp assembly according to claim 18, wherein securement of the board and the heat sink together holds the light-emitting diode package in place relative to the board within the lamp assembly.

23. The lamp assembly according to claim 1, comprising a plurality of light-emitting diode packages mounted to the heat sink and comprising a plurality of openings of the board.

24. A lamp assembly comprising:

a light-emitting diode package comprising a substrate with a top surface and bottom surface and electrical contacts on the substrate;

a board comprising a face surface, a rear surface opposite the face surface and at least one opening extending from the rear surface to the face surface that is alignable with at least a portion of the light-emitting diode package, the board comprising electrical contacts thereon for electrical connection with the electrical contacts of the light-emitting diode package; and

the substrate of the light-emitting diode package engaging the opening of the board to couple the light-emitting diode package to the board so that the bottom surface of the substrate of the light-emitting diode package aligns along a common plane with the rear surface of the board.

25. The lamp assembly according to claim 24, wherein a shape of the opening in the board corresponds to a shape of the substrate of the light-emitting diode package.

26. The lamp assembly according to claim 25, wherein sides of the substrate of the light-emitting diode package frictionally engage inner walls of the board defining the opening therein.

27. The lamp assembly according to claim 26, wherein the electrical contacts of the board are disposed on the face surface of the board and electrical connection between the board and the light-emitting diode package is made by wires reflowed between the electrical contacts of the board and the electrical contacts of the light-emitting diode package on a top-side of the lamp assembly.

28. The lamp assembly according to claim 26, wherein the electrical contacts of the board comprise spring contacts that are disposed on the face surface of the board and extend into the opening of the board, and electrical connection between the board and the light-emitting diode package is made by contact of the spring contacts of the board and the electrical contacts of the light-emitting diode package.

29. The lamp assembly according to claim 24, wherein the light-emitting diode package comprises a lens.

30. The lamp assembly according to claim 29, wherein a shape of the opening through the face surface of the board corresponds to a shape of a base of the lens of the light-emitting diode package and the board defines a recess on the rear surface of the board that forms a portion of the opening with the recess corresponding to a shape of the substrate of the light-emitting diode package.

31. The lamp assembly according to claim 30, wherein sides of the substrate of the light-emitting diode package frictionally engage inner walls of the board defining the recess so that only the lens extends above the face surface of the board.

32. The lamp assembly according to claim 30, wherein the electrical contacts of the board are disposed within the recess of the board and electrical connection between the board and the substrate of the light-emitting diode package is made by contact between the electrical contacts of the board and electrical contacts on the top surface of the substrate of the light-emitting diode package.

33. The lamp assembly according to claim 32, wherein the electrical contacts on the board comprise at least one of pogo pins, solder balls, spikes, and electrical receptacles.

34. The lamp assembly according to claim 24, wherein the board comprises a printed circuit board.

35. The lamp assembly according to claim 34, wherein the printed circuit board comprises one or more larger electrical contacts.

36. The lamp assembly according to claim 24, further comprising a heat sink on which the substrate of the light-emitting diode package is attachable.

37. The lamp assembly according to claim 36, wherein the board and the heat sink are secured together.

38. The lamp assembly according to claim 37, wherein the board comprises one or more securement holes and the heat sink comprises one or more securement holes that are alignable with each other and further comprising one or more attachment devices configured for insertion into the aligned securement holes to hold the board to the heat sink.

39. The lamp assembly according to claim 37, wherein the board and the heat sink are secured by an epoxy placed between the board and the heat sink.

40. The lamp assembly according to claim 37, wherein securement of the board and the heat sink together holds the light-emitting diode package in place within the lamp assembly.

41. The lamp assembly according to claim 24, comprising a plurality of light-emitting diode packages mounted to the heat sink and comprising a plurality of openings of the board.

42. The lamp assembly according to claim 24, wherein the substrate of the light-emitting diode package engages the opening of the board to mechanically couple the light-emitting diode package to the board.

43. A lamp assembly comprising:

a heat sink;

a board comprising a face surface, a rear surface opposite the face surface, an opening extending from the face surface to the rear surface, and electrical contacts, at least a portion of the rear face of the board being mounted to the heat sink;

at least one light emitting diode positioned in the opening of the board and mounted to the heat sink, the at least one light emitting diode comprising electrical contacts for electrical connection with the electrical contacts of the board.

44. A method of assembling a light-emitting diode lamp assembly, the method comprising:

providing a heat sink and a light-emitting diode package comprising a substrate and electrical contacts;

providing a board comprising a face surface, a rear surface opposite the face surface and an opening extending from the face surface to the rear surface, the board comprising electrical contacts thereon,

mounting the light-emitting diode package to the heat sink,

aligning the opening of the board with the light-emitting diode package; and

engaging the opening of the board with the substrate of the light-emitting diode package to mechanically couple the light-emitting diode package to the board and to align the electrical contacts of the board with the electrical contacts of the light-emitting diode package.

45. The method according to claim 44, wherein a shape of the opening in the board matchingly corresponds to a shape of the substrate of the light-emitting diode package.

46. The method according to claim 45, wherein the step of engaging comprises frictionally engaging inner walls of the board defining the opening therein with sides of the substrate of the light-emitting diode package.

47. The method according to claim 44, wherein the light-emitting diode package comprises a lens, and wherein a shape of the opening through the face surface of the board corresponds to a shape of base of the lens of the light-emitting diode package and the board defines a recess on the rear surface of the board that forms a portion of the opening with the recess corresponding to a shape of the substrate of the light-emitting diode package.

48. The method according to claim 47, wherein the step of engaging comprises inserting the lens of the light-emitting diode package through the opening and engaging the substrate of the light-emitting diode package in the recess of the board.

49. The method according to claim 44, further comprising securing the board to the heat sink.

50. The method according to claim 49, wherein securing the board to the heat sink comprises aligning one or more securement holes in the board with one or more securement holes in the heat sink and inserting attachment devices into the aligned securement holes to secure the board to the heat sink.

51. The method according to claim 49, further comprising holding the light-emitting diode package in place relative to the board within the lamp assembly by securement of the board and the heat sink together.

52. The method according to claim 44, wherein the light-emitting diode package comprises a lens, and wherein aligning the opening of the board comprises aligning the lens of the light-emitting diode package with the opening of the board.

53. The method of claim 44, wherein the light-emitting diode package comprises a substrate with a top and bottom surface and with electrical contacts only on the top surface of the substrate.

54. A method of assembling a light-emitting diode lamp assembly, the method comprising:

providing at least one light-emitting diode package comprising a substrate with a top surface and a bottom surface and electrical contacts;

providing a board comprising a face surface, a rear surface opposite the face surface and at least opening extending from the face surface to the rear surface, the board comprising electrical contacts,

aligning the opening of the board with the light-emitting diode package; and

engaging the opening of the board with the substrate of the light-emitting diode package to mechanically couple the light-emitting diode package to the board such that the bottom surface of the substrate of the light-emitting diode package aligns along a common plane with the rear surface of the board and the electrical contacts of the board align with the electrical contacts of the light-emitting diode package.

55. The method according to claim 54, wherein a shape of the opening in the board matchingly corresponds to a shape of the substrate of the light-emitting diode package.

56. The method according to claim 55, wherein the step of engaging comprises frictionally engaging inner walls of the board defining the opening therein with sides of the substrate of the light-emitting diode package.

57. The method according to claim 54, wherein the light-emitting diode package comprises a lens and wherein a shape of the opening through the face surface of the board corresponds to a shape of a base of the lens of the light-emitting diode package and the board defines a recess on the rear surface of the board that forms a portion of the opening with the recess corresponding to the shape of the substrate of the light-emitting diode package.

58. The method according to claim 57, wherein the step of engaging comprises inserting the lens of the light-emitting diode package through the opening and engaging the substrate of the light-emitting diode package in the recess of the board.

59. The method according to claim 54, further comprising providing a heat sink and mounting the light-emitting diode package to the heat sink after engaging the light-emitting diode package in the board.

60. The method according to claim 59, further comprising securing the board to the heat sink.

61. The method according to claim 60, wherein securing the board to the heat sink further comprises aligning one or more securement holes in the board with one or more securement holes in the heat sink and inserting attachment devices into the aligned securement holes to secure the board to the heat sink.

62. The method according to claim 60, further comprising holding the light-emitting diode package in place relative to the board within the lamp assembly by securement of the board and the heat sink together.

63. The method according to claim 54, wherein the light-emitting diode package comprises a lens and wherein aligning the opening of the board comprises aligning the lens of the light-emitting diode package with the opening of the board.

64. The method according to claim 54, wherein the board comprises a printed circuit board.