LAMP ASSEMBLIES AND METHODS OF MAKING THE SAME
First Claim
1. A lamp assembly comprising:
- a heat sink;
at least one light-emitting diode package mounted to the heat sink, the light-emitting diode package comprising a substrate and electrical contacts;
a board comprising a face surface, a rear surface opposite the face surface and an opening extending from the face surface to the rear surface, the board comprising electrical contacts for electrical connection with the electrical contacts of the light-emitting diode package, andthe substrate of the light-emitting diode package engaging the opening of the board to mechanically couple the light-emitting diode package to the board.
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Accused Products
Abstract
Lamp assemblies and methods of making the same are provided. Such a lamp assembly can include a heat sink and a light-emitting diode package that can be mounted to the heat sink. The light-emitting diode package can include a substrate with a top surface and bottom surface, a lens, and electrical contacts on the surface of the substrate. The lamp assembly can also include a printed circuit board with a face surface, a rear surface opposite the face surface and an opening extending from the face surface to the rear surface. The printed circuit board can have electrical contacts thereon for electrical connection with the electrical contacts of the light-emitting diode package. The substrate of the light-emitting diode package can engage the opening of the printed circuit board to mechanically couple the light-emitting diode package to the printed circuit board. When assembled, a bottom surface of the substrate can be flush and aligned with a rear surface of the printed circuit board.
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Citations
64 Claims
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1. A lamp assembly comprising:
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a heat sink; at least one light-emitting diode package mounted to the heat sink, the light-emitting diode package comprising a substrate and electrical contacts; a board comprising a face surface, a rear surface opposite the face surface and an opening extending from the face surface to the rear surface, the board comprising electrical contacts for electrical connection with the electrical contacts of the light-emitting diode package, and the substrate of the light-emitting diode package engaging the opening of the board to mechanically couple the light-emitting diode package to the board. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20, 21, 22, 23)
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24. A lamp assembly comprising:
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a light-emitting diode package comprising a substrate with a top surface and bottom surface and electrical contacts on the substrate; a board comprising a face surface, a rear surface opposite the face surface and at least one opening extending from the rear surface to the face surface that is alignable with at least a portion of the light-emitting diode package, the board comprising electrical contacts thereon for electrical connection with the electrical contacts of the light-emitting diode package; and the substrate of the light-emitting diode package engaging the opening of the board to couple the light-emitting diode package to the board so that the bottom surface of the substrate of the light-emitting diode package aligns along a common plane with the rear surface of the board. - View Dependent Claims (25, 26, 27, 28, 29, 30, 31, 32, 33, 34, 35, 36, 37, 38, 39, 40, 41, 42)
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43. A lamp assembly comprising:
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a heat sink; a board comprising a face surface, a rear surface opposite the face surface, an opening extending from the face surface to the rear surface, and electrical contacts, at least a portion of the rear face of the board being mounted to the heat sink; at least one light emitting diode positioned in the opening of the board and mounted to the heat sink, the at least one light emitting diode comprising electrical contacts for electrical connection with the electrical contacts of the board.
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44. A method of assembling a light-emitting diode lamp assembly, the method comprising:
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providing a heat sink and a light-emitting diode package comprising a substrate and electrical contacts; providing a board comprising a face surface, a rear surface opposite the face surface and an opening extending from the face surface to the rear surface, the board comprising electrical contacts thereon, mounting the light-emitting diode package to the heat sink, aligning the opening of the board with the light-emitting diode package; and engaging the opening of the board with the substrate of the light-emitting diode package to mechanically couple the light-emitting diode package to the board and to align the electrical contacts of the board with the electrical contacts of the light-emitting diode package. - View Dependent Claims (45, 46, 47, 48, 49, 50, 51, 52, 53)
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54. A method of assembling a light-emitting diode lamp assembly, the method comprising:
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providing at least one light-emitting diode package comprising a substrate with a top surface and a bottom surface and electrical contacts; providing a board comprising a face surface, a rear surface opposite the face surface and at least opening extending from the face surface to the rear surface, the board comprising electrical contacts, aligning the opening of the board with the light-emitting diode package; and engaging the opening of the board with the substrate of the light-emitting diode package to mechanically couple the light-emitting diode package to the board such that the bottom surface of the substrate of the light-emitting diode package aligns along a common plane with the rear surface of the board and the electrical contacts of the board align with the electrical contacts of the light-emitting diode package. - View Dependent Claims (55, 56, 57, 58, 59, 60, 61, 62, 63, 64)
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Specification