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OUT OF PLANE INTEGRAL CONDUCTIVE ARMS AND METHODS FOR MANUFACTURING THE SAME

  • US 20110092083A1
  • Filed: 10/16/2009
  • Published: 04/21/2011
  • Est. Priority Date: 10/16/2009
  • Status: Active Grant
First Claim
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1. A structure comprising:

  • a circuit board having at least one conductive arm, wherein the conductive arm has an unconnected end located opposite to a connected end of the conductive arm that is connected to the circuit board, wherein the conductive arm has a front side and a back side located opposite to the front side of the conductive arm, wherein the backside of the conductive arm is located adjacent to the circuit board, and wherein the unconnected end of the conductive arm includes a dimple portion formed integrally with and as a unitary part of a remaining portion of the conductive arm, the dimple portion being out of plane with in plane portions of the connected end of the conductive arm so that the dimple portion is at a greater distance from the circuit board than the in plane portions of the conductive arm, the dimple portion being connected to the in plane portions of the conductive arm via an integrally formed and unitary riser portion, andan air gap formed between the back side of the conductive arm at least at the dimple portion and the circuit board, permitting the conductive arm to flex into a space of the air gap.

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