LIGHT EMITTING DEVICE PACKAGE AND LIGHTING SYSTEM

• US 20110095321A1
• Filed: 10/25/2010
• Published: 04/28/2011
• Est. Priority Date: 10/26/2009
• Status: Active Grant

• Current Assignee: Suzhou Lekin Semiconductor Company Limited
• Original Assignee: LG Innotek Company Limited (LG Corporation)
• Inventors: Hwang, Jung Ha, SONG, Yong Seon
• Granted Patent: US 9,035,325 B2
• Time in Patent Office: Days
• US Class Current: 257/98
• CPC Class Codes: H01L 2224/45124 Aluminium (Al) as principal constituent
• CPC Class Codes: H01L 2224/45144 Gold (Au) as principal constituent
• CPC Class Codes: H01L 2224/45147 Copper (Cu) as principal constituent
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48465 the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
• CPC Class Codes: H01L 2224/8592 Applying permanent coating, e.g. protective coating
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00012 Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H01L 2924/181 Encapsulation
• CPC Class Codes: H01L 2933/0041 relating to wavelength conversion elements
• CPC Class Codes: H01L 33/505 characterised by the shape, e.g. plate or foil
• CPC Class Codes: H01L 33/508 having a non-uniform spatial arrangement or non-uniform concentration, e.g. patterned wavelength conversion layer, wavelength conversion layer with a concentration gradient of the wavelength conversion material
• CPC Class Codes: H01L 33/54 having a particular shape

Abstract

A light emitting device (LED) package includes a submount and a light emitting chip. The submount has a chip region and a supporting region over which the chip is mounted, and an encapsulating material and fluorescent material are formed over the chip. The coverage area of encapsulating and fluorescent materials is substantially coextensive with the chip or chip region, and a first area between an edge of the chip region and an edge of the supporting region is greater than a second area between the edge of the chip region and the chip.

Claims

1. A light emitting device package comprising:

a submount including a chip region and a supporting region;

a light emitting chip over the chip region of the submount; and

an encapsulating material and a fluorescent material over the chip, wherein;

the encapsulating material is at least partially transparent,

a coverage area of the encapsulating material and the fluorescent material is substantially coextensive with the chip region, and

a first area between an edge of the chip region and an edge of the supporting region is greater than a second area between the edge of the chip region and the chip.

2. The package of claim 1, wherein the first area is located on a top surface of the supporting region and the second area is located on a top surface of the chip region.

3. The package of claim 1, wherein a length of a surface between the edge of the chip region and the chip is substantially equal to a thickness of the chip, said length included in the second area which is not covered by the chip.

4. The package of claim 1, wherein a length of a surface between the edge of the chip region and the chip is greater than a thickness of the chip, said length included in the second area which is not covered by the chip.

5. The package of claim 4, wherein the length of the surface between the edge of the chip region and the chip is approximately 2 to 10 times greater than the thickness of the chip.

6. The package of claim 1, wherein a top surface of the chip region is raised relative to a top surface of the supporting region.

7. The package of claim 1, wherein the encapsulating material includes the fluorescent material.

8. The package of claim 7, wherein the fluorescent material is distributed uniformly throughout the encapsulating material over the chip region.

9. The package of claim 1, wherein the encapsulating material has a substantially elliptical or semi-spherical shape.

10. The package of claim 1, comprising:

a wire bonded to the chip; and

a lens over the encapsulating material.

11. The package of claim 10, wherein the lens covers at least a portion of the supporting region.

12. The package of claim 1, wherein a top surface of the chip region includes a groove at a location not covered by the chip, said groove located in the second area.

13. The package of claim 12, wherein the encapsulating material extends into the groove.

24. A lighting system including the package of claim 1, wherein the package is mounted over a substrate of a light emitting module.

14. A light emitting device package comprising:

a submount including a chip region and a supporting region;

a light emitting chip over the chip region of the submount; and

an encapsulating material and a fluorescent material over the chip, wherein;

the encapsulating material is at least partially transparent,

a coverage area of the encapsulating material and fluorescent material is substantially coextensive with the chip region, and

a top surface of the chip region includes at least one groove at a location not covered by the chip, the encapsulating material extending into the at least one groove.

15. The package of claim 14, wherein the at least one groove is a continuous groove.

16. The package of claim 14, wherein the top surface of the chip region includes a plurality of grooves.

17. A light emitting device package comprising:

a submount including a chip region and a supporting region;

a light emitting chip over the chip region of the submount;

a first encapsulating material over the chip; and

a second encapsulating material over the first encapsulating material, wherein;

the first and second encapsulating materials are at least partially transparent,

the first or second encapsulating material includes a fluorescent material,

a coverage area of the first encapsulating material is substantially coextensive with the chip region, and

the first encapsulating material contacts the chip region and the second encapsulating material contacts a surface of the supporting region

18. The package of claim 17, wherein the second encapsulating material serves as an optical lens

19. The package of claim 17, wherein the first encapsulating material includes a fluorescent material.

20. A light emitting device package comprising:

a submount including a chip region and a supporting region;

a light emitting chip over the chip region of the submount; and

an encapsulating material and a fluorescent material over the chip, wherein;

the encapsulating material is at least partially transparent,

a coverage area of the encapsulating material and the fluorescent material is substantially coextensive with the chip and does not substantially overlap either of an area of the chip region not covered by the chip or an area of the supporting region not covered by the chip region.

21. The package of claim 20, wherein a length of a surface between an edge of the chip region and the chip is substantially equal to a thickness of the chip.

22. The package of claim 20, wherein a length of a surface between an edge of the chip region and the chip is 2 to 10 times greater than a thickness of the chip.

23. The package of claim 20, wherein a first area between an edge of the chip region and an edge of the supporting region is greater than a second area between the edge of the chip region and the chip.