MICROELECTRONIC ASSEMBLIES HAVING COMPLIANT LAYERS
First Claim
1. A microelectronic assembly, comprising:
- a semiconductor chip having a first surface extending in lateral directions, at least one edge surface extending in a direction transverse to said lateral directions, and a plurality of contacts exposed at said first surface;
a supporting element adjacent said at least one edge surface and extending in at least one of said lateral directions away from said semiconductor chip, said supporting element having a top surface;
a compliant layer overlying said top surface of said supporting element and said semiconductor chip, said compliant layer having a top surface facing away from said top surface of said supporting element and said first surface of said semiconductor chip, said compliant layer having at least one sloping surface extending between said top surface of said compliant layer and said first surface of said semiconductor chip;
conductive terminals exposed at said top surface of said compliant layer, at least one of said terminals not overlying said first surface of said semiconductor chip;
bond ribbons overlying said top surface of said compliant layer and extending along said at least one sloping surface of said compliant layer, said bond ribbons electrically connecting said chip contacts and said conductive terminals.
3 Assignments
0 Petitions
Accused Products
Abstract
A compliant semiconductor chip package assembly includes a semiconductor chip having a plurality of chip contacts, and a compliant layer having a top surface, a bottom surface and sloping peripheral edges, whereby the bottom surface of the compliant layer overlies a surface of the semiconductor chip. The assembly also includes a plurality of electrically conductive traces connected to the chip contacts of the semiconductor chip, the traces extending along the sloping edges to the top surface of the compliant layer. The assembly may include conductive terminals overlying the semiconductor chip, with the compliant layer supporting the conductive terminals over the semiconductor chip. The conductive traces have first ends electrically connected with the contacts of the semiconductor chip and second ends electrically connected with the conductive terminals. The conductive terminals are movable relative to the semiconductor chip.
103 Citations
20 Claims
-
1. A microelectronic assembly, comprising:
-
a semiconductor chip having a first surface extending in lateral directions, at least one edge surface extending in a direction transverse to said lateral directions, and a plurality of contacts exposed at said first surface; a supporting element adjacent said at least one edge surface and extending in at least one of said lateral directions away from said semiconductor chip, said supporting element having a top surface; a compliant layer overlying said top surface of said supporting element and said semiconductor chip, said compliant layer having a top surface facing away from said top surface of said supporting element and said first surface of said semiconductor chip, said compliant layer having at least one sloping surface extending between said top surface of said compliant layer and said first surface of said semiconductor chip; conductive terminals exposed at said top surface of said compliant layer, at least one of said terminals not overlying said first surface of said semiconductor chip; bond ribbons overlying said top surface of said compliant layer and extending along said at least one sloping surface of said compliant layer, said bond ribbons electrically connecting said chip contacts and said conductive terminals. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15)
-
-
16. A microelectronic assembly, comprising:
-
a semiconductor chip having a first surface extending in lateral directions, at least one edge surface extending in a direction transverse to said lateral directions, and a plurality of contacts exposed at said first surface; a supporting element adjacent said at least one edge surface and extending in at least one of said lateral directions away from said semiconductor chip, said supporting element having a top surface; a compliant layer overlying said top surface of said supporting element and said semiconductor chip, said compliant layer having a top surface facing away from said top surface of said supporting element and said first surface of said semiconductor chip, said compliant layer having at least one sloping surface extending between said top surface of said compliant layer and said first surface of said semiconductor chip; conductive terminals exposed at said top surface of said compliant layer, at least one of said terminals not overlying said first surface of said semiconductor chip; bond ribbons formed integrally with said terminals, said bond ribbons extending along said at least one sloping surface of said compliant layer, said bond ribbons electrically connecting said chip contacts and said conductive terminals. - View Dependent Claims (17, 18, 19, 20)
-
Specification