Overmolded LED Light Assembly and Method of Manufacture
First Claim
1. An LED lighting apparatus, comprising:
- an electronic circuit board having a peripheral portion and a central portion that is radially inward of said peripheral portion, said electronic circuit board having an exterior side for optically interfacing with ambient environment during operation and an interior side opposite the exterior side;
at least one LED mounted on the exterior side of the electronic circuit board central portion; and
a thermally conductive housing enclosing said electronic circuit board, said thermally conductive housing formed of a moldable thermally conductive material;
said thermally conductive housing defining a first cavity adjacent the central portion of the electronic circuit board exterior side and a second cavity adjacent the central portion of the electronic circuit board interior side, a portion of said thermally conductive housing being overmolded onto said peripheral portion.
1 Assignment
0 Petitions
Accused Products
Abstract
In one aspect, an LED lighting apparatus includes an electronic circuit board having a peripheral portion and a central portion that is radially inward of said peripheral portion, said electronic circuit board having an exterior side for optically interfacing with ambient environment during operation and an interior side opposite the exterior side. At least one LED is mounted on the exterior side of the electronic circuit board central portion and a thermally conductive housing encloses said electronic circuit board, said thermally conductive housing formed of a moldable thermally conductive material. The thermally conductive housing defines a first cavity adjacent the central portion of the electronic circuit board exterior side and a second cavity adjacent the central portion of the electronic circuit board interior side, wherein a portion of said thermally conductive housing being overmolded onto said peripheral portion. In a further aspect, a method of manufacturing an LED lighting apparatus is provided.
-
Citations
27 Claims
-
1. An LED lighting apparatus, comprising:
-
an electronic circuit board having a peripheral portion and a central portion that is radially inward of said peripheral portion, said electronic circuit board having an exterior side for optically interfacing with ambient environment during operation and an interior side opposite the exterior side; at least one LED mounted on the exterior side of the electronic circuit board central portion; and a thermally conductive housing enclosing said electronic circuit board, said thermally conductive housing formed of a moldable thermally conductive material; said thermally conductive housing defining a first cavity adjacent the central portion of the electronic circuit board exterior side and a second cavity adjacent the central portion of the electronic circuit board interior side, a portion of said thermally conductive housing being overmolded onto said peripheral portion. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18)
-
-
19. A method of manufacture, comprising:
-
providing an electronic circuit board having a peripheral portion and a central portion that is radially inward of said peripheral portion, said electronic circuit board having an exterior side for optically interfacing with ambient environment during operation and an interior side opposite the exterior side; mounting at least one LED mounted on said exterior side of the electronic circuit board central portion; and overmolding said electronic circuit board peripheral portion with a moldable thermally conductive material to form an overmolded thermally conductive housing enclosing said electronic circuit board, said thermally conductive housing defining a first cavity adjacent the central portion of the electronic circuit board exterior side and a second cavity adjacent the central portion of the electronic circuit board interior side. - View Dependent Claims (20, 21, 22, 23, 24, 25, 26, 27)
-
Specification