INKJET NOZZLE WITH PADDLE LAYER ARRANGED BETWEEN FIRST AND SECOND WAFERS
First Claim
1. An inkjet nozzle comprising:
- a first wafer having active drive circuitry together with an ink jet print nozzle formed therein;
a second wafer having an ink channel formed therein; and
a paddle layer sandwiched between the first and second wafers in a chamber complementarily defined by the wafers, the paddle layer in signal communication with the active drive circuitry, so that ink supplied via the ink channel is ejected via the print nozzle upon actuation of the paddle layer by the circuitry, whereinthe first wafer includes a silicon wafer upon which is fabricated an epitaxial boron doped layer, an epitaxial silicon layer, drive transistors and distribution circuitry forming a CMOS logic and drive transistor level, and a silicon nitride layer.
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Accused Products
Abstract
An inkjet nozzle includes a first wafer having active drive circuitry together with an ink jet print nozzle formed therein; a second wafer having an ink channel formed therein; and a paddle layer sandwiched between the first and second wafers in a chamber complementarily defined by the wafers. The paddle layer is in signal communication with the active drive circuitry so that ink supplied via the ink channel is ejected via the print nozzle upon actuation of the paddle layer by the circuitry. The first wafer includes a silicon wafer upon which is fabricated an epitaxial boron doped layer, an epitaxial silicon layer, drive transistors and distribution circuitry forming a CMOS logic and drive transistor level, and a silicon nitride layer.
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Citations
3 Claims
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1. An inkjet nozzle comprising:
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a first wafer having active drive circuitry together with an ink jet print nozzle formed therein; a second wafer having an ink channel formed therein; and a paddle layer sandwiched between the first and second wafers in a chamber complementarily defined by the wafers, the paddle layer in signal communication with the active drive circuitry, so that ink supplied via the ink channel is ejected via the print nozzle upon actuation of the paddle layer by the circuitry, wherein the first wafer includes a silicon wafer upon which is fabricated an epitaxial boron doped layer, an epitaxial silicon layer, drive transistors and distribution circuitry forming a CMOS logic and drive transistor level, and a silicon nitride layer. - View Dependent Claims (2, 3)
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Specification